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XC7K325T-2FBG900I

Xilinx

XC7K325T-2FBG900I by Xilinx

Xilinx XC7K325T-2FBG900I FPGA offers 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact 31mm grid array package.

Median Price

$2,598.075

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Mouser Electronics

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Overview

Unlock a world of possibilities with the XC7K325T-2FBG900I by Xilinx, a cutting-edge Field Programmable Gate Array that redefines innovation. With over 326,000 logic cells and a maximum clock frequency of 1818 MHz, this FPGA is designed to push boundaries and deliver unparalleled performance. Manufactured by Xilinx, a pioneer in the industry known for quality and reliability, this product offers customers the flexibility to customize their designs and bring their visions to life. From telecommunications to automotive industries, the XC7K325T-2FBG900I caters to a wide range of applications, providing value and benefits that are unmatched in the market. Experience the power of Xilinx and revolutionize your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the FPGA, making it suitable for a variety of environments.

No. of Logic Cells: 326080

With a large number of logic cells, this FPGA can handle complex logic operations efficiently.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA reliable for various applications.

Maximum Clock Frequency: 1818 MHz

The high maximum clock frequency allows for fast operation and processing, making it suitable for high-performance applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K325T-2FBG900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

326080

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

25475

Maximum Clock Frequency:

1818 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

25475 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K325T-2FBG900I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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