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XC6SLX150-3FGG900C

Xilinx

XC6SLX150-3FGG900C by Xilinx

Xilinx XC6SLX150-3FGG900C FPGA features 147443 logic cells, 11519 CLBs, and 570 inputs/outputs. Utilized in applications requiring high-speed processing up to 862 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.

Median Price

$466.690

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Digiode

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Corohmni

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Texas Native Microelectronics

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Kenton Components

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One Stop Electronics

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Argo Parts USA

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Lixinc

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Overview

Unleash the power of innovation with the Xilinx XC6SLX150-3FGG900C Field Programmable Gate Array (FPGA). Xilinx is renowned for its cutting-edge technology and high-quality products, and this FPGA is no exception. With 147443 logic cells and 11519 CLBs, this versatile device offers unmatched performance and flexibility for a wide range of applications. Whether you're in telecommunications, automotive, or aerospace industries, this FPGA delivers exceptional value and benefits. Embrace the future of technology with Xilinx and take your projects to new heights with the XC6SLX150-3FGG900C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides durability and can withstand various environmental conditions, making the product reliable for different applications.

No. of Logic Cells: 147443

With a high number of logic cells, this FPGA allows for complex logic functions to be implemented efficiently, making it suitable for advanced applications.

Surface Mount: YES

Being surface mountable makes installation and soldering of this FPGA easier and more convenient, saving time during production.

Maximum Supply Voltage: 1.26 V

Having a maximum supply voltage of 1.26 V ensures safe operation and compatibility with various power sources, offering flexibility in design.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the FPGA energy efficient and reliable in noisy environments.

No. of Inputs: 570

Having a high number of inputs allows for versatile connectivity and input/output configurations, enabling the FPGA to interface with numerous devices and sensors.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V provides stable operation and efficient performance, making the FPGA suitable for a wide range of applications.

Power Supplies (V): 1.2,2.5/3.3

Supporting multiple power supply voltages offers compatibility with different systems and power sources, enhancing the versatility of the FPGA.

No. of Terminals: 900

The high number of terminals provides ample connectivity options and flexibility in circuit design, allowing for complex interconnections in the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for reconfiguration and customization of logic functions, making the FPGA adaptable to changing requirements and applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and mechanical stability, ensuring reliable performance and durability of the FPGA.

Maximum Clock Frequency: 862 MHz

With a high maximum clock frequency, the FPGA can support fast processing and real-time operations, making it suitable for high-speed applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX150-3FGG900C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

147443

No. of Inputs:

570

No. of Outputs:

570

No. of CLBs:

11519

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

11519 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX150-3FGG900C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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