Loading...

TFBGA Other Function uPs,uCs & Peripheral ICs 16

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
AWR1443FQIGABLQ1 by Texas Instruments

AWR1443FQIGABLQ1

Texas Instruments

AWR1443FQIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1443FQIGABLRQ1 by Texas Instruments

AWR1443FQIGABLRQ1

Texas Instruments

AWR1443FQIGABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.2 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

MCIMX7D5EVK10SD by NXP Semiconductors

MCIMX7D5EVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.2 V;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3DVK10SC by NXP Semiconductors

MCIMX7D3DVK10SC

NXP Semiconductors

MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SC by NXP Semiconductors

MCIMX7D3EVK10SC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D2DVK12SD by NXP Semiconductors

MCIMX7D2DVK12SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

85 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3DVK10SD by NXP Semiconductors

MCIMX7D3DVK10SD

NXP Semiconductors

MCIMX7D3DVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating at 0-95°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring thin profile, fine pitch grid arrays in plastic/epoxy packages.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SD by NXP Semiconductors

MCIMX7D3EVK10SD

NXP Semiconductors

MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D7DVK10SD by NXP Semiconductors

MCIMX7D7DVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

AWR1642ABIGABLQ1 by Texas Instruments

AWR1642ABIGABLQ1

Texas Instruments

AWR1642ABIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and TIN SILVER COPPER finish.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1572864

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1642ABISABLQ1 by Texas Instruments

AWR1642ABISABLQ1

Texas Instruments

AWR1642ABISABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14-1.32 V, making it ideal for AUTOMOTIVE applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1572864

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1642ABISABLRQ1 by Texas Instruments

AWR1642ABISABLRQ1

Texas Instruments

AWR1642ABISABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package style is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and 0.65 mm pitch.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1572864

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

NOT SPECIFIED

10.4 mm

MICROPROCESSOR CIRCUIT

MIMX8MN5DVPIZCA by NXP Semiconductors

MIMX8MN5DVPIZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B306

11 mm

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

SoC

MIMX8MN3DVPIZAA by NXP Semiconductors

MIMX8MN3DVPIZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN3DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and compact design in various electronic devices.

S-PBGA-B306

11 mm

3

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

11 mm

SoC

MIMX8MN1DVPIZAA by NXP Semiconductors

MIMX8MN1DVPIZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN1DVPIZAA is a SoC with 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and low power consumption in compact electronic devices.

S-PBGA-B306

11 mm

3

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

11 mm

SoC

MIMX8MN5DVPIZDA by NXP Semiconductors

MIMX8MN5DVPIZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B306

11 mm

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

SoC