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FBGA Microprocessors 218

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
T1013NSN7MQA by NXP Semiconductors

T1013NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7PQA by NXP Semiconductors

T1023NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7KQA by NXP Semiconductors

T1013NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7PQA by NXP Semiconductors

T1013NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7KQA by NXP Semiconductors

T1013NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7MQA by NXP Semiconductors

T1013NXE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7PQA by NXP Semiconductors

T1013NXE7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7PQA by NXP Semiconductors

T1023NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7PQA by NXP Semiconductors

T1023NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-speed processing, it operates b/w 0 to 105°C with low power mode support.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7KQA by NXP Semiconductors

T1023NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7PQA by NXP Semiconductors

T1013NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7MQA by NXP Semiconductors

T1013NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7KQA by NXP Semiconductors

T1013NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7PQA by NXP Semiconductors

T1013NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1013NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. It is designed for applications requiring high-speed processing and low power consumption, with integrated cache memory and support for boundary scan testing.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7MQA by NXP Semiconductors

T1023NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

LS1028AXE7KQA by NXP Semiconductors

LS1028AXE7KQA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

64

YES

32

FIXED-POINT

YES

S-PBGA-B448

17 mm

YES

3

1

33

448

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30x30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1000 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

TDA4VM88TGBALFR by Texas Instruments

TDA4VM88TGBALFR

Texas Instruments

TDA4VM88TGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various embedded systems.

0

64

YES

27 MHz

32

FLOATING-POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

26

827

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

DRA829VMTGBALFR by Texas Instruments

DRA829VMTGBALFR

Texas Instruments

DRA829VMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for high-speed computing applications. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various industrial settings.

0

64

YES

27 MHz

32

FIXED POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

31

827

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

3670016

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

TDA4VM88TGBALFRQ1 by Texas Instruments

TDA4VM88TGBALFRQ1

Texas Instruments

TDA4VM88TGBALFRQ1 by Texas Instruments is a microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for automotive applications, it operates b/w -40 to 125°C, features boundary scan capability, and has a max clock frequency of 27 MHz.

0

64

YES

27 MHz

32

FLOATING-POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

26

827

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

AEC-Q100

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

DRA829JMTGBALFR by Texas Instruments

DRA829JMTGBALFR

Texas Instruments

DRA829JMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates b/w -40 to 105 °C, has a max clock frequency of 27 MHz, and features boundary scan for testing. Ideal for applications requiring high-speed processing in automotive systems or industrial automation.

0

64

YES

27 MHz

32

FIXED POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

31

827

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

DRA829JMTGBALFRQ1 by Texas Instruments

DRA829JMTGBALFRQ1

Texas Instruments

DRA829JMTGBALFRQ1 by Texas Instruments is a Microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. It operates b/w -40 to 125 °C and features a max clock frequency of 27 MHz. Ideal for automotive applications requiring high processing power in a compact package.

0

64

YES

27 MHz

32

FIXED POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

31

827

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

AEC-Q100

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

T2080NXN8MQB by NXP Semiconductors

T2080NXN8MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

T2080NXE8P1B by NXP Semiconductors

T2080NXE8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

T2080NXE8MQB by NXP Semiconductors

T2080NXE8MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

FS32V234CTN1VUB by NXP Semiconductors

FS32V234CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Integrated Cache: YES;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V232CTN1VUB by NXP Semiconductors

FS32V232CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC