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FBGA Microprocessors 218

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
T2081NSN8T1B by NXP Semiconductors

T2081NSN8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8MQLB by NXP Semiconductors

T2081NXE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8P1B by NXP Semiconductors

T2081NXE8P1B

NXP Semiconductors

The NXP Semiconductors T2081NXE8P1B microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates in temperatures ranging from -40 to 105°C and offers low power mode for energy efficiency.

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8PTB by NXP Semiconductors

T2081NXE8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8T1B by NXP Semiconductors

T2081NXE8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8TTB by NXP Semiconductors

T2081NXE8TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8MQLB by NXP Semiconductors

T2081NXN8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8P1B by NXP Semiconductors

T2081NXN8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8PTB by NXP Semiconductors

T2081NXN8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8T1B by NXP Semiconductors

T2081NXN8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8TTB by NXP Semiconductors

T2081NXN8TTB

NXP Semiconductors

The NXP Semiconductors T2081NXN8TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. The package style is grid array with 780 terminals in a square shape.

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

FS32V232BMN1VUB by NXP Semiconductors

FS32V232BMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234BJN1VUB by NXP Semiconductors

FS32V234BJN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234BLN1VUB by NXP Semiconductors

FS32V234BLN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234BMN1VUB by NXP Semiconductors

FS32V234BMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234CKN1VUB by NXP Semiconductors

FS32V234CKN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234CMN1VUB by NXP Semiconductors

FS32V234CMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234CON1VUB by NXP Semiconductors

FS32V234CON1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

LS1043ASE7KQB by NXP Semiconductors

LS1043ASE7KQB

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V NOMINAL SUPPLY

16

64

YES

32

FIXED POINT

YES

S-PBGA-B621

e1

21 mm

YES

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1000 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SoC

LS1043ASE7PQB by NXP Semiconductors

LS1043ASE7PQB

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V NOMINAL SUPPLY

16

64

YES

32

FIXED POINT

YES

S-PBGA-B621

e1

21 mm

YES

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SoC

LS1043ASE7QQB by NXP Semiconductors

LS1043ASE7QQB

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V NOMINAL SUPPLY

16

64

YES

32

FIXED POINT

YES

S-PBGA-B621

e1

21 mm

YES

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1600 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SoC

LS1043ASE8PQB by NXP Semiconductors

LS1043ASE8PQB

NXP Semiconductors

LS1043ASE8PQB by NXP Semiconductors is a 64-bit microprocessor with integrated cache, 32-bit external data bus width, and low power mode. It is used in System on Chip (SoC) applications for high-speed processing at temperatures up to 105°C.

ALSO OPERATES AT 1V NOMINAL SUPPLY

14

64

YES

32

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

LS1043ASN8MQB by NXP Semiconductors

LS1043ASN8MQB

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V NOMINAL SUPPLY

14

64

YES

32

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

LS1043AXE7QQB by NXP Semiconductors

LS1043AXE7QQB

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V NOMINAL SUPPLY

16

64

YES

32

FIXED POINT

YES

S-PBGA-B621

e1

21 mm

YES

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SoC

BSC9131NSN1KHKB,557 by NXP Semiconductors

BSC9131NSN1KHKB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 520; Package Code: FBGA; Package Shape: SQUARE;

16

32

YES

32

FIXED POINT

YES

S-PBGA-B520

21 mm

YES

520

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

1.97 mm

1000 rpm

1.05 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

21 mm

MICROPROCESSOR, RISC

P1014NSN5FFA,557 by NXP Semiconductors

P1014NSN5FFA,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;

0

32

YES

100 MHz

0

FLOATING POINT

YES

S-PBGA-B425

19 mm

YES

425

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR, RISC

T1023NXE7PQA by NXP Semiconductors

T1023NXE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7PQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is grid array with fine pitch terminals for compact design.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

P1010NSN5HFB by NXP Semiconductors

P1010NSN5HFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5FFB by NXP Semiconductors

P1010NXE5FFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5FFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 667 rpm with a temperature range of -40 to 105°C.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5KHB by NXP Semiconductors

P1010NXN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5HFB by NXP Semiconductors

P1010NXE5HFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5KHB by NXP Semiconductors

P1010NXE5KHB

NXP Semiconductors

The NXP Semiconductors P1010NXE5KHB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5FFB by NXP Semiconductors

P1010NXN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSE5FFB by NXP Semiconductors

P1010NSE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5DFB by NXP Semiconductors

P1010NSN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5FFB by NXP Semiconductors

P1010NSN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5KHB by NXP Semiconductors

P1010NSN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5DFB by NXP Semiconductors

P1010NXN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MCIMX537CVP8C2 by NXP Semiconductors

MCIMX537CVP8C2

NXP Semiconductors

MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

32

52

529

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

800 rpm

800 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MCIMX535DVP2C2 by NXP Semiconductors

MCIMX535DVP2C2

NXP Semiconductors

MCIMX535DVP2C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words and 27 MHz clock frequency. It features a CMOS technology, 529 terminals, and operates b/w -20 to 85 °C. Ideal for applications requiring high-speed processing in compact devices.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

5

529

8

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

1200 rpm

800 mA

1.4 V

1.3 V

1.35 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MCIMX535DVP1C2 by NXP Semiconductors

MCIMX535DVP1C2

NXP Semiconductors

MCIMX535DVP1C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 529 terminals. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

5

529

8

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

1000 rpm

800 mA

1.4 V

1.2 V

1.25 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

T1023NSN7KQA by NXP Semiconductors

T1023NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7KQA by NXP Semiconductors

T1023NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7MQA by NXP Semiconductors

T1023NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7KQA by NXP Semiconductors

T1023NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7MQA by NXP Semiconductors

T1023NXE7MQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7MQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. With a package style of grid array and fine pitch, it offers 525 terminals for versatile connectivity.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7MQA by NXP Semiconductors

T1013NSE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7KQA by NXP Semiconductors

T1013NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR