Loading...

TSOP2 Other Function Memory ICs 32

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
MR256A08BCYS35R by Everspin Technologies

MR256A08BCYS35R

Everspin Technologies

MR256A08BCYS35R by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, and has a max access time of 35ns. Ideal for industrial applications requiring fast asynchronous memory operations in a compact package.

35 ns

R-PDSO-G44

18.41 mm

262144 bit

MEMORY CIRCUIT

8

3

1

44

32768 words

32K

ASYNCHRONOUS

85 Cel

-40 Cel

32KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

3.3

Not Qualified

1.2 mm

.007 Amp

SRAMs

65 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

GULL WING

.8 mm

DUAL

10.16 mm

MR256A08BCYS35 by Everspin Technologies

MR256A08BCYS35

Everspin Technologies

MR256A08BCYS35 by Everspin Technologies is a 32Kx8 memory IC with CMOS technology. It operates asynchronously at a nominal voltage of 3.3V, with a max access time of 35ns. This industrial-grade IC is ideal for applications requiring fast and reliable memory storage in compact spaces.

35 ns

R-PDSO-G44

18.41 mm

262144 bit

MEMORY CIRCUIT

8

1

44

32768 words

32K

ASYNCHRONOUS

85 Cel

-40 Cel

32KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

NOT SPECIFIED

3.3

Not Qualified

1.2 mm

.007 Amp

SRAMs

65 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

GULL WING

.8 mm

DUAL

NOT SPECIFIED

10.16 mm

MR256A08BYS35R by Everspin Technologies

MR256A08BYS35R

Everspin Technologies

MR256A08BYS35R by Everspin Technologies is a 32Kx8 memory IC with CMOS technology. It operates asynchronously at 3.3V, has a max access time of 35ns, and consumes up to 65mA. This small outline, thin profile package is ideal for applications requiring fast and reliable memory storage in commercial temperature environments.

35 ns

R-PDSO-G44

18.41 mm

262144 bit

MEMORY CIRCUIT

8

1

44

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

NOT SPECIFIED

3.3

Not Qualified

1.2 mm

.007 Amp

SRAMs

65 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.8 mm

DUAL

NOT SPECIFIED

10.16 mm

MR256A08BYS35 by Everspin Technologies

MR256A08BYS35

Everspin Technologies

MR256A08BYS35 by Everspin Technologies is a 32Kx8 memory IC with CMOS technology. It operates asynchronously at 3.3V, with a max access time of 35ns. This small outline, thin profile package is ideal for applications requiring high-speed memory solutions in commercial temperature environments.

35 ns

R-PDSO-G44

18.41 mm

262144 bit

MEMORY CIRCUIT

8

1

44

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

NOT SPECIFIED

3.3

Not Qualified

1.2 mm

.007 Amp

SRAMs

65 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.8 mm

DUAL

NOT SPECIFIED

10.16 mm

MR2A16AMYS35R by Everspin Technologies

MR2A16AMYS35R

Everspin Technologies

MR2A16AMYS35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 125°C and is AEC-Q100 compliant for automotive applications. This small outline, thin profile package with 44 terminals is ideal for high-performance asynchronous memory needs in automotive electronics.

R-PDSO-G44

18.41 mm

4194304 bit

MEMORY CIRCUIT

16

1

44

262144 words

256K

ASYNCHRONOUS

125 Cel

-40 Cel

256KX16

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

NOT SPECIFIED

AEC-Q100

1.2 mm

3.6 V

3 V

3.3

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

DUAL

NOT SPECIFIED

10.16 mm

MR2A16AMYS35 by Everspin Technologies

MR2A16AMYS35

Everspin Technologies

MR2A16AMYS35 by Everspin Tech: 256KX16 memory IC with 4194304 bit density. Operating at -40 to 125 °C, it's AEC-Q100 graded for automotive applications. Features include 3.3V supply, small outline package, and dual terminal position.

R-PDSO-G44

18.41 mm

4194304 bit

MEMORY CIRCUIT

16

1

44

262144 words

256K

ASYNCHRONOUS

125 Cel

-40 Cel

256KX16

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

NOT SPECIFIED

AEC-Q100

1.2 mm

3.6 V

3 V

3.3

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

DUAL

NOT SPECIFIED

10.16 mm

XC17S05VO8C by Xilinx

XC17S05VO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

53984 bit

MEMORY CIRCUIT

1

3

1

8

53984 words

53984

SYNCHRONOUS

70 Cel

0 Cel

53984X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S05VO8I by Xilinx

XC17S05VO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Standby Current: .00005 Amp;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

53984 bit

MEMORY CIRCUIT

1

3

1

8

53984 words

53984

SYNCHRONOUS

85 Cel

-40 Cel

53984X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S05XLVO8C by Xilinx

XC17S05XLVO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 54544X1;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

54544 bit

MEMORY CIRCUIT

1

3

1

8

54544 words

54544

SYNCHRONOUS

70 Cel

0 Cel

54544X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S05XLVO8I by Xilinx

XC17S05XLVO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 54544X1;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

54544 bit

MEMORY CIRCUIT

1

3

1

8

54544 words

54544

SYNCHRONOUS

85 Cel

-40 Cel

54544X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S10VO8C by Xilinx

XC17S10VO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

95008 bit

MEMORY CIRCUIT

1

3

1

8

95008 words

95008

SYNCHRONOUS

70 Cel

0 Cel

95008X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S10VO8I by Xilinx

XC17S10VO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

95008 bit

MEMORY CIRCUIT

1

3

1

8

95008 words

95008

SYNCHRONOUS

85 Cel

-40 Cel

95008X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S10XLVO8C by Xilinx

XC17S10XLVO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

95752 bit

MEMORY CIRCUIT

1

3

1

8

95752 words

95752

SYNCHRONOUS

70 Cel

0 Cel

95752X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S10XLVO8I by Xilinx

XC17S10XLVO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

95752 bit

MEMORY CIRCUIT

1

3

1

8

95752 words

95752

SYNCHRONOUS

85 Cel

-40 Cel

95752X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S20VO8C by Xilinx

XC17S20VO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Input/Output Type: COMMON;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

178144 bit

MEMORY CIRCUIT

1

3

1

8

178144 words

178144

SYNCHRONOUS

70 Cel

0 Cel

178144X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S20VO8I by Xilinx

XC17S20VO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Density: 178144 bit;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

178144 bit

MEMORY CIRCUIT

1

3

1

8

178144 words

178144

SYNCHRONOUS

85 Cel

-40 Cel

178144X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S20XLVO8C by Xilinx

XC17S20XLVO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words: 179160 words;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

179160 bit

MEMORY CIRCUIT

1

3

1

8

179160 words

179160

SYNCHRONOUS

70 Cel

0 Cel

179160X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S20XLVO8I by Xilinx

XC17S20XLVO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

179160 bit

MEMORY CIRCUIT

1

3

1

8

179160 words

179160

SYNCHRONOUS

85 Cel

-40 Cel

179160X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S30VO8C by Xilinx

XC17S30VO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

247968 bit

MEMORY CIRCUIT

1

3

1

8

247968 words

247968

SYNCHRONOUS

70 Cel

0 Cel

247968X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S30VO8I by Xilinx

XC17S30VO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

247968 bit

MEMORY CIRCUIT

1

3

1

8

247968 words

247968

SYNCHRONOUS

85 Cel

-40 Cel

247968X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S30XLVO8C by Xilinx

XC17S30XLVO8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Technology: CMOS;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

249168 bit

MEMORY CIRCUIT

1

3

1

8

249168 words

249168

SYNCHRONOUS

70 Cel

0 Cel

249168X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S30XLVO8I by Xilinx

XC17S30XLVO8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 249168X1;

10 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

249168 bit

MEMORY CIRCUIT

1

3

1

8

249168 words

249168

SYNCHRONOUS

85 Cel

-40 Cel

249168X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

225

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

30

3.9 mm

MR0A08BCYS35R by Everspin Technologies

MR0A08BCYS35R

Everspin Technologies

MR0A08BCYS35R by Everspin Tech: 128KX8 memory IC with 1048576 bit density, operates at 3.3V, and has a max access time of 35 ns. Ideal for industrial applications requiring fast asynchronous memory operations in a compact small outline package.

35 ns

R-PDSO-G44

18.41 mm

1048576 bit

MEMORY CIRCUIT

8

3

1

44

131072 words

128K

ASYNCHRONOUS

85 Cel

-40 Cel

128KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

3.3

Not Qualified

1.2 mm

.007 Amp

SRAMs

70 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

GULL WING

.8 mm

DUAL

10.16 mm

MR0A08BYS35R by Everspin Technologies

MR0A08BYS35R

Everspin Technologies

MR0A08BYS35R by Everspin Technologies is a 128KX8 memory circuit with a CMOS technology. It operates asynchronously at a nominal voltage of 3.3V and has a max access time of 35ns. This memory IC is commonly used in applications that require high-speed data storage and retrieval.

35 ns

R-PDSO-G44

18.41 mm

1048576 bit

MEMORY CIRCUIT

8

3

1

44

131072 words

128K

ASYNCHRONOUS

70 Cel

0 Cel

128KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

3.3

Not Qualified

1.2 mm

.007 Amp

SRAMs

65 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.8 mm

DUAL

10.16 mm

MR0A08BYS35 by Everspin Technologies

MR0A08BYS35

Everspin Technologies

MR0A08BYS35 by Everspin: 128KX8 memory IC with 3.3V supply, 35ns access time, and 1048576 bit density. Ideal for commercial applications requiring fast asynchronous operation in a small outline package.

35 ns

R-PDSO-G44

18.41 mm

1048576 bit

MEMORY CIRCUIT

8

3

1

44

131072 words

128K

ASYNCHRONOUS

70 Cel

0 Cel

128KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

3.3

Not Qualified

1.2 mm

.007 Amp

SRAMs

65 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.8 mm

DUAL

10.16 mm

XC17S10VOG8C by Xilinx

XC17S10VOG8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Input/Output Type: COMMON;

10 MHz

COMMON

R-PDSO-G8

e3

4.9 mm

95008 bit

MEMORY CIRCUIT

1

3

1

8

95008 words

95008

SYNCHRONOUS

70 Cel

0 Cel

95008X1

3-STATE

PLASTIC/EPOXY

TSOP2

DIP8,.3

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

260

5

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S10XLVOG8C by Xilinx

XC17S10XLVOG8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;

10 MHz

COMMON

R-PDSO-G8

e3

4.9 mm

95752 bit

MEMORY CIRCUIT

1

3

1

8

95752 words

95752

SYNCHRONOUS

70 Cel

0 Cel

95752X1

3-STATE

PLASTIC/EPOXY

TSOP2

DIP8,.3

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

260

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S10XLVOG8I by Xilinx

XC17S10XLVOG8I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-609 Code: e3;

10 MHz

COMMON

R-PDSO-G8

e3

4.9 mm

95752 bit

MEMORY CIRCUIT

1

3

1

8

95752 words

95752

SYNCHRONOUS

85 Cel

-40 Cel

95752X1

3-STATE

PLASTIC/EPOXY

TSOP2

DIP8,.3

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

260

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S20XLVOG8C by Xilinx

XC17S20XLVOG8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words: 179160 words;

10 MHz

COMMON

R-PDSO-G8

e3

4.9 mm

179160 bit

MEMORY CIRCUIT

1

3

1

8

179160 words

179160

SYNCHRONOUS

70 Cel

0 Cel

179160X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

260

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17S30XLVOG8C by Xilinx

XC17S30XLVOG8C

Xilinx

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Power Supplies (V): 3.3;

10 MHz

COMMON

R-PDSO-G8

e3

4.9 mm

249168 bit

MEMORY CIRCUIT

1

3

1

8

249168 words

249168

SYNCHRONOUS

70 Cel

0 Cel

249168X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

260

3.3

Not Qualified

1.2 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

30

3.9 mm

MR2A08AMYS35R by Everspin Technologies

MR2A08AMYS35R

Everspin Technologies

Everspin Technologies' MR2A08AMYS35R is a 256Kx8 memory IC with 2097152 bit density. Operating at 3.3V, it has a max access time of 35ns and AEC-Q100 screening level for automotive applications. This small outline, thin profile package is ideal for asynchronous operations in automotive electronics with a temperature range from -40 to 125°C.

35 ns

R-PDSO-G44

18.41 mm

2097152 bit

MEMORY CIRCUIT

8

1

44

262144 words

256K

ASYNCHRONOUS

125 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

NOT SPECIFIED

3.3

Not Qualified

AEC-Q100

1.2 mm

.02 Amp

SRAMs

135 mA

3.6 V

3 V

3.3

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

DUAL

NOT SPECIFIED

10.16 mm

MR2A08AMYS35 by Everspin Technologies

MR2A08AMYS35

Everspin Technologies

MR2A08AMYS35 by Everspin Technologies is a 256Kx8 memory IC with CMOS technology. It operates at 3.3V, has a max access time of 35ns, and is AEC-Q100 screened for automotive applications. With a small outline package style and gull wing terminal form, it is suitable for various memory circuit needs in automotive electronics.

35 ns

R-PDSO-G44

18.41 mm

2097152 bit

MEMORY CIRCUIT

8

1

44

262144 words

256K

ASYNCHRONOUS

125 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

NOT SPECIFIED

3.3

Not Qualified

AEC-Q100

1.2 mm

.02 Amp

SRAMs

135 mA

3.6 V

3 V

3.3

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

DUAL

NOT SPECIFIED

10.16 mm