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XCVU5P-2FLVA2104I

Xilinx

XCVU5P-2FLVA2104I by Xilinx

Xilinx XCVU5P-2FLVA2104I FPGA offers 1313763 logic cells, 75072 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V.

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Vyrian

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One Stop Electronics

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Overview

Experience unparalleled performance and versatility with the XCVU5P-2FLVA2104I by Xilinx, a leader in FPGA technology. This cutting-edge Field Programmable Gate Array boasts over 1.3 million logic cells and 75072 CLBs, making it ideal for a wide range of applications. With a package style of GRID ARRAY and a nominal supply voltage of 0.85V, this FPGA offers unmatched flexibility and efficiency. Unlock endless possibilities and elevate your projects to new heights with the XCVU5P-2FLVA2104I - the ultimate choice for those seeking top-tier quality and innovation in FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage.

No. of Logic Cells: 1313763

Having a large number of logic cells allows for complex programmable logic designs to be implemented efficiently.

Surface Mount: YES

Surface mount technology simplifies the PCB assembly process and enables a compact design for the FPGA.

Maximum Supply Voltage: 0.876 V

Low supply voltage helps in reducing power consumption and heat generation while maintaining reliable operation.

No. of CLBs: 75072

A high number of Configurable Logic Blocks (CLBs) provides flexibility and scalability in designing logic circuits.

No. of Inputs: 832

Having a large number of inputs allows for versatile input configurations and connectivity options.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and allows for efficient use of space on the board.

Nominal Supply Voltage (V): 0.85

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

No. of Terminals: 2104

Higher terminal count provides ample connectivity options for interfacing with external devices and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a reprogrammable FPGA, it offers flexibility to reconfigure logic functions based on application requirements without hardware changes.

Package Style (Meter): GRID ARRAY

Grid array package style simplifies the routing of signals on the PCB and enhances signal integrity.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage ensures operation in low-power environments and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance allows the FPGA to operate reliably in harsh environmental conditions.

Pitch Of Terminal: 1 mm

Optimal terminal pitch enhances soldering accuracy and reliability during PCB assembly.

Organization: 75072 CLBS

Well-organized CLBs streamline the logic design process and enable efficient utilization of resources.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the FPGA can withstand extreme cold environments without performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of these materials for terminal finishing enhances solderability, conductivity, and corrosion resistance of the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, facilitating efficient routing of signals.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates the FPGA is suitable for reflow soldering processes and can withstand moderate moisture exposure.

Maximum Seated Height: 4.11 mm

Low seated height enables a compact PCB design and reduces the overall profile of the electronic system.

Width: 47.5 mm

Moderate width allows for easy integration of the FPGA into standard PCB form factors and enclosure designs.

No. of Outputs: 832

Having a high number of outputs enables versatile signal routing configurations and connectivity options.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the FPGA can undergo efficient solder reflow processes without compromising performance.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance ensures the FPGA can withstand elevated temperatures during assembly processes without damage.

Length: 47.5 mm

Moderate length allows for easy integration of the FPGA into standard PCB form factors and enclosure designs.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures the FPGA can operate reliably in demanding industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCVU5P-2FLVA2104I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1313763

No. of Inputs:

832

No. of Outputs:

832

No. of CLBs:

75072

Organization:

75072 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

47.5 mm

Width:

47.5 mm

Maximum Seated Height:

4.11 mm

Package Equivalence Code:

BGA2104,46X46,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2104

JESD-609 Code:

e1

Trade Compliance

XCVU5P-2FLVA2104I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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