Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCVU5P-2FLVA2104I FPGA offers 1313763 logic cells, 75072 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V.
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This material is lightweight and durable, making the FPGA easy to handle and resistant to damage.
Having a large number of logic cells allows for complex programmable logic designs to be implemented efficiently.
Surface mount technology simplifies the PCB assembly process and enables a compact design for the FPGA.
Low supply voltage helps in reducing power consumption and heat generation while maintaining reliable operation.
A high number of Configurable Logic Blocks (CLBs) provides flexibility and scalability in designing logic circuits.
Having a large number of inputs allows for versatile input configurations and connectivity options.
Square package shape facilitates easier PCB layout and allows for efficient use of space on the board.
Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.
Higher terminal count provides ample connectivity options for interfacing with external devices and peripherals.
Being a reprogrammable FPGA, it offers flexibility to reconfigure logic functions based on application requirements without hardware changes.
Grid array package style simplifies the routing of signals on the PCB and enhances signal integrity.
Low minimum supply voltage ensures operation in low-power environments and extends battery life in portable devices.
High maximum operating temperature tolerance allows the FPGA to operate reliably in harsh environmental conditions.
Optimal terminal pitch enhances soldering accuracy and reliability during PCB assembly.
Well-organized CLBs streamline the logic design process and enable efficient utilization of resources.
Low minimum operating temperature ensures the FPGA can withstand extreme cold environments without performance degradation.
The use of these materials for terminal finishing enhances solderability, conductivity, and corrosion resistance of the FPGA.
Bottom terminal position simplifies PCB layout and assembly, facilitating efficient routing of signals.
MSL 4 rating indicates the FPGA is suitable for reflow soldering processes and can withstand moderate moisture exposure.
Low seated height enables a compact PCB design and reduces the overall profile of the electronic system.
Moderate width allows for easy integration of the FPGA into standard PCB form factors and enclosure designs.
Having a high number of outputs enables versatile signal routing configurations and connectivity options.
With a maximum reflow time of 30 seconds, the FPGA can undergo efficient solder reflow processes without compromising performance.
High peak reflow temperature tolerance ensures the FPGA can withstand elevated temperatures during assembly processes without damage.
Moderate length allows for easy integration of the FPGA into standard PCB form factors and enclosure designs.
Industrial-grade temperature rating ensures the FPGA can operate reliably in demanding industrial environments with varying temperature conditions.
Field Programmable Gate Arrays (FPGA) XCVU5P-2FLVA2104I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
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No. of Outputs:
No. of CLBs:
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Nominal Supply Voltage:
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Maximum Supply Voltage:
Minimum Operating Temperature:
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Temperature Grade:
Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
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Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
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JESD-30 Code:
JESD-609 Code:
XCVU5P-2FLVA2104I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A001.A.7.B
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
SMBJ18CA
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM7805CT
Texas Instruments
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM555CMX
Onsemi
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
LD1117S33TR
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Baneasa S A
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
EP3C16F256I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
10M50SCE144C8G
Intel
The Intel 10M50SCE144C8G is a FPGA with 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. It operates at supply voltages of 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile device is ideal for applications requiring high-speed data processing and customizable logic functions in a compact form factor.
LFXP2-5E-5TN144I
Lattice Semiconductor
LFXP2-5E-5TN144I by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 435 MHz. It has 100 inputs/outputs, uses CMOS tech, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices or industrial automation systems.
A3P1000-PQG208M
Microchip Technology
A3P1000-PQG208M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. It operates at a max clock frequency of 350 MHz, making it suitable for military-grade applications requiring high-speed processing in harsh environments. With a package style of flatpack and fine pitch, this FPGA is ideal for compact electronic systems that demand efficient performance.
XC7K160T-2FFG676I
Xilinx
Xilinx XC7K160T-2FFG676I FPGA features 162240 logic cells, 12675 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
ICE40LP384-SG32TR1K
ICE40LP384-SG32TR1K by Lattice Semiconductor is a CMOS FPGA with 48 CLBs, 32 terminals, and max supply voltage of 1.26V. Ideal for industrial applications requiring high performance in compact form factor with operating temp range of -40 to 100°C. Package style includes chip carrier and very thin profile for versatile integration.
10CL080YU484I7G
Intel's 10CL080YU484I7G FPGA features 5079 CLBs, operates at -40 to 100 °C, with a supply voltage of 1.2V. Ideal for industrial applications requiring high performance and flexibility in a compact GRID ARRAY package with 0.8mm terminal pitch.
EP4CE40F23C6N
EP4CE40F23C6N by Intel is a FPGA with 39600 logic cells, 2475 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing such as telecommunications, networking equipment, and industrial automation due to its advanced programmable features and versatile package style.
10M02SCU169I7G
The Intel 10M02SCU169I7G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
EP1C3T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC6SLX45-2CSG324C
The Xilinx XC6SLX45-2CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at up to 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability.
ICE5LP4K-SG48ITR
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
EP3C25F256C8NES
EP3C25F256C8NES by Altera is a plastic/epoxy FPGA with 24624 CLBs. It operates at a supply voltage range of 1.15V to 1.25V and supports a maximum clock frequency of 472.5 MHz. It has a low-profile, grid array package with 256 terminals.
M2GL090T-1FG484M
M2GL090T-1FG484M by Microchip Technology is a CMOS FPGA with 86316 logic cells, 267 inputs/outputs, and operates at 1.2V. It is used in military-grade applications requiring high performance and reliability in harsh environments.
ICE40HX4K-CB132
ICE40HX4K-CB132 by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and 95 inputs/outputs. Operating at max frequency of 133 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and very thin profile, it offers versatility in design while maintaining reliability.
M2GL010-TQG144I
M2GL010-TQG144I by Microchip is a 144-terminal FPGA with max supply voltage of 1.26V, suitable for industrial applications. With a square package and gull wing terminals, it operates b/w -40 to 100 °C and has a low profile flatpack style. Ideal for high-performance electronic systems requiring programmable ICs in compact form factors.
XC7K325T-1FB676I
XC7K325T-1FB676I by Xilinx is a CMOS-based FPGA with 326080 logic cells and a max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.
EP4CE30F23C8N
EP4CE30F23C8N by Intel is a FPGA with 28848 logic cells, 1803 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities due to its versatile features and performance.
EP4CE75F23C8N
EP4CE75F23C8N by Intel is a FPGA with 75408 logic cells and 4713 CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications like signal processing and data acceleration. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.
5CSTFD6D5F31I7N
The Altera 5CSTFD6D5F31I7N is a CMOS field programmable gate array (FPGA) with 110,000 logic cells and 288 inputs/outputs. It operates at a maximum supply voltage of 1.13V and has a square package shape with a BGA896 package code. It is suitable for a variety of applications including digital signal processing, communications, and industrial automation.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCVU47P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4;
XCVU3P-2FFVC1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGB2104I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGC2104I
XCVU3P-1FFVC1517E
Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.
XCVU3P-2FFVC1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-L2FSGD2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
XCVU13P-L2FHGA2104E
XCVU11P-1FLGB2104I
XCVU19P-1FSVA3824E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XCVU3P-L2FFVC1517E
XCVU9P-L2FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XCVU33P-2FSVH2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240;
XCVU9P-1FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGA2104E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-1FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2892; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-3FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-L2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 4;
XCVU13P-L2FHGC2104E
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