Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;
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Other Function uPs,uCs & Peripheral ICs XCVC1902-2MLEVSVA2197 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
JESD-30 Code:
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XCVC1902-2MLEVSVA2197 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diotec Semiconductor Ag
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
Leshan Radio
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
2N2222A
Space Power Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
1552200168
Molex
WIRE AND CABLE;
Laube Technology
Nexperia
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Semitronics
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
RN2903A-I/RM098
Microchip Technology
Microchip RN2903A-I/RM098 is a CMOS microprocessor IC with 47 terminals. It operates b/w -40 to 85°C, with supply voltage range of 2.1-3.6V. Ideal for industrial applications requiring TS16949 screening and surface mount compatibility.
DS8007-ENG+
Maxim Integrated
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
M82820G-15
M/a-com Technology Solutions
Other uPs/uCs/Peripheral ICs;
CY8C4248LQI-BL583
Infineon Technologies
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
14450R-500
Renesas Electronics
SoC;
CC1310F128RSMT
Texas Instruments
CC1310F128RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85°C, with a supply voltage range of 1.8-3.8V. Ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.
CY8C6116BZI-F54
CY8C6116BZI-F54 by Infineon Technologies is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a square package style and very thin profile, it's ideal for applications requiring high-performance microcontrollers in compact spaces.
ATWINC1500-MR210PB1172
ATWINC1500-MR210PB1172 by Microchip operates at 2.7-3.6V, with temp range -40 to 85°C. Its MICROELECTRONIC ASSEMBLY style has 28 terminals and CMOS tech for INDUSTRIAL applications in MICROPROCESSOR CIRCUITS.
EFR32MG21A020F768IM32-B
Silicon Labs
EFR32MG21A020F768IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) with CMOS technology suitable for various IoT applications requiring compact and low-power solutions.
MSP430F6777AIPZ
MSP430F6777AIPZ by Texas Instruments is a 16-bit microprocessor circuit with 262144 ROM words and 32 RAM words. It has 6 ADC channels, 3 DMA channels, and offers connectivity through I2C, IRDA, SPI, and UART. This IC is commonly used in industrial applications due to its temperature grade of -40 to +85 °C.
EFR32BG24A010F1024IM40-BR
EFR32BG24A010F1024IM40-BR by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount ICs in various electronic devices.
TDA8035HN/C1,118
NXP Semiconductors
NXP Semiconductors' TDA8035HN/C1,118 is a 32-terminal IC with a supply voltage range of 2.7V to 5.5V and operates b/w -25°C to 85°C. This MICROPROCESSOR CIRCUIT has a max supply current of 220mA and is ideal for applications requiring low power consumption in compact designs. The chip carrier package style with very thin profile makes it suitable for space-constrained environments.
FT245BL-REEL
FTDI
FT245BL-REEL by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V, operating temperature of 0-70°C, and peak reflow temp of 260°C. Ideal for microprocessor circuits, it features CMOS technology and Gull Wing terminal form in a low-profile flatpack package style.
XC7Z030-2FBG484E
Xilinx
XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.
453-00052C
Laird Technologies
SLB9665TT20FW563XUMA3
Infineon's SLB9665TT20FW563XUMA3 is a cryptographic authenticator IC with 28 terminals, operating at -20 to 85 °C. It has a supply voltage range of 3-3.6 V and compact dimensions of 4.4mm x 9.7mm, suitable for secure applications requiring high data protection in small form factors.
TCI6630K2LCMSA
TCI6630K2LCMSA by Texas Instruments is a CMOS microprocessor circuit with 900 ball terminals in a grid array package. It operates b/w 0.902V to 0.997V, making it suitable for high-performance applications requiring low supply voltage. Ideal for advanced electronic systems demanding efficient processing power in a compact form factor.
ESP32-WROOM-32E-N4
Espressif Systems (Shanghai)
ESP32-WROOM-32E-N4 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 3-3.6 V. Ideal for IoT applications, it features a rectangular package style and is suitable for surface mount assembly.
MCIMX6G3CVM05AB
MCIMX6G3CVM05AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105°C, has 289 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.15-1.3V. Ideal for industrial applications requiring low profile and fine pitch components.
5CSTFD6D5F31I7N
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCVC1902-2MLEVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVC1902-2MSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
XCVC1902-1LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
XCVC1902-1MSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2197;
XCVC1352-1GLEVBVA1024
MICROPROCESSOR CIRCUIT;
XCVC1352-1HLEVBVA1024
XCVC1352-1HLIVBVA1024
XCVC1352-1HLIVSVE1369
XCVC1352-1DLEVSVE1369
XCVC1352-1DSEVBVA1024
XCVC1352-1GLIVBVA1024
XCVC1352-1GSIVSVE1369
XCVC1352-1DSIVSVE1369
XCVC1352-1HLEVSVE1369
XCVC1352-1DLIVSVE1369
XCVC1352-1GLIVSVE1369
XCVC1352-1DSEVSVE1369
XCVC1352-1GSEVBVA1024
XCVC1352-1GSEVSVE1369
XCVC1352-1GLEVSVE1369
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