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XCVC1902-1MSIVSVA2197

Xilinx

XCVC1902-1MSIVSVA2197 by Xilinx

XCVC1902-1MSIVSVA2197 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 110 °C and has a supply voltage range of 0.775V to 0.825V. With 2197 terminals in a GRID ARRAY package, it's ideal for advanced electronic applications requiring high processing power in compact spaces.

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Overview

Enhance your electronic projects with the XCVC1902-1MSIVSVA2197 by Xilinx, a top-of-the-line microprocessor circuit that guarantees optimal performance and reliability. With Xilinx's renowned reputation for quality and innovation in the industry, this product ensures seamless integration and exceptional functionality in various applications. From cutting-edge technology to efficient design, the XCVC1902-1MSIVSVA2197 offers unparalleled value and benefits, making it the ideal choice for customers seeking superior solutions in the field of Other Function uPs,uCs & Peripheral ICs. Upgrade your projects today with the XCVC1902-1MSIVSVA2197 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic packages as it provides good insulation and protection for the components inside.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 0.825 V

With a high maximum supply voltage, this product can handle a wide range of input power, making it versatile for different applications.

Package Shape: SQUARE

A square package shape helps with easy orientation and alignment during installation on the circuit board.

No. of Terminals: 2197

Having a high number of terminals allows for more connections and functions, making this product suitable for intricate circuit designs.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array style provides a compact form factor while the heat sink/slug helps with heat dissipation, ensuring optimal performance under high temperatures.

Minimum Supply Voltage: 0.775 V

A low minimum supply voltage ensures that the product can still operate effectively even with lower power input levels.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this product can withstand heat and perform reliably in various environments.

Minimum Operating Temperature: -40 °C

The ability to operate in cold temperatures down to -40°C makes this product suitable for use in a wide range of climates.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring stable connections over time.

Terminal Position: BOTTOM

Bottom terminal position allows for easier board mounting and better access to the terminals.

Maximum Seated Height: 4 mm

With a low seated height, this product can fit into compact spaces and slim devices.

Width: 45 mm

The width of 45mm provides a good balance between compact size and ease of handling during installation.

Length: 45 mm

The length of 45mm complements the square package shape, making it easy to integrate into circuit designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced computing capabilities and can handle complex tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides good solder joint reliability and helps with easy installation on the circuit board.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage of 0.8 V is common and widely supported, making this product compatible with various power sources.

Terminal Pitch: 0.92 mm

With a small terminal pitch of 0.92 mm, this product allows for dense packing of terminals on the board, saving space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVC1902-1MSIVSVA2197 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B2197

JESD-609 Code:

e1

Length:

45 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA2197,47X47,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.825 V

Minimum Supply Voltage:

.775 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

45 mm

Peripheral IC Type:

Trade Compliance

XCVC1902-1MSIVSVA2197 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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