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XCV300-6FGG456C

Xilinx

XCV300-6FGG456C by Xilinx

Xilinx XCV300-6FGG456C is a FPGA with 1536 CLBs, 322970 gates, and max clock freq of 333 MHz. It operates at 2.375-2.625 V, has combinatorial delay of 0.6 ns, and uses CMOS tech. Ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors.

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AZTECH Wire

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Overview

Unlock endless possibilities with the Xilinx XCV300-6FGG456C Field Programmable Gate Array (FPGA). Manufactured by industry leader Xilinx, this FPGA boasts 1536 CLBs and 322970 gates, offering unparalleled performance and flexibility. Whether you're designing cutting-edge electronics or implementing advanced signal processing algorithms, the XCV300-6FGG456C delivers unmatched speed and reliability. Experience seamless integration and rapid prototyping with this versatile FPGA, setting a new standard in programmable IC technology. Elevate your projects to new heights with the Xilinx XCV300-6FGG456C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and provides good mechanical strength, making the product durable and efficient.

Maximum Supply Voltage: 2.625 V

The higher maximum supply voltage allows for better performance and flexibility in power management.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

No. of Equivalent Gates: 322970

With a large number of equivalent gates, this FPGA can handle complex logic operations and calculations effectively.

Maximum Clock Frequency: 333 MHz

The high maximum clock frequency ensures fast processing and response times, making the product suitable for demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCV300-6FGG456C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of CLBs:

1536

No. of Equivalent Gates:

322970

Maximum Clock Frequency:

333 MHz

CLB Maximum Delay:

0.6 ns

Technology:

CMOS

Organization:

1536 CLBS, 322970 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

456

Standards

JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCV300-6FGG456C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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