Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Technology Used: CMOS; Qualification: Not Qualified; Organization: 1536 CLBS, 322970 GATES; Minimum Supply Voltage: 2.375 V; Nominal Supply Voltage (V): 2.5;
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Field Programmable Gate Arrays (FPGA) XCV300-4CS144I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of CLBs:
No. of Equivalent Gates:
CLB Maximum Delay:
Technology:
Organization:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Moisture Sensitivity Level (MSL):
Terminal Finish:
JESD-609 Code:
Qualified:
XCV300-4CS144I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hy Electronic
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
ESD5Z5.0T1G
Onsemi
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
1552200253
Molex
WIRE AND CABLE;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
CRCW080510R0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510R0FKEA is a fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V. Operating temperature range from -55 to 155 °C ensures reliability in various environments.
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
EP4CE15F17C8N
Altera
EP4CE15F17C8N by Altera is a Field Programmable Gate Array (FPGA) with 15408 logic cells, 963 CLBs, 165 inputs/outputs, and a maximum clock frequency of 472.5 MHz. It is suited for various applications that require programmable ICs and high-performance processing.
EP4CE115F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
MPF300T-1FCG784E
Microchip Technology
MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.
EP4CE6E22I7N
EP4CE6E22I7N by Altera is a Field Programmable Gate Array (FPGA) with 6272 logic cells, 392 CLBs, and a maximum clock frequency of 472.5 MHz. It has 91 inputs and outputs, and operates at a maximum supply voltage of 1.25V. This FPGA is surface mountable and comes in a square package shape with 144 terminals. Its compact size and high-performance capabilities make it suitable for various applications in the electronics industry.
10CL040ZU484I8G
Intel
The Intel 10CL040ZU484I8G is a Field Programmable Gate Array (FPGA) with 39,600 logic cells and 2,475 configurable logic blocks (CLBs). It has a max supply voltage of 1.03V and can operate in temperatures ranging from -40°C to 100°C. This FPGA is commonly used for industrial applications requiring high-performance programmable ICs.
10M08SAU169I7G
Intel 10M08SAU169I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a package style of GRID ARRAY and PLASTIC/EPOXY material, it is ideal for industrial applications requiring high-performance programmable ICs. Operating b/w -40 to 100 °C, this FPGA offers versatility in various electronic designs.
LCMXO3LF-6900C-6BG256I
Lattice Semiconductor
LCMXO3LF-6900C-6BG256I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a grid array package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.
LFE5U-45F-6BG554I
Lattice Semiconductor's LFE5U-45F-6BG554I FPGA features 44000 logic cells, 5500 CLBs, and 245 inputs/outputs. With a max supply voltage of 1.155V, it is ideal for applications requiring high-performance computing in industrial automation, telecommunications, and automotive systems.
10M08SCU169A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
A3P250-VQG100
A3P250-VQG100 by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at max 1.575V, it offers a clock frequency of 350MHz. Ideal for applications requiring high gate count and fast processing speeds in commercial temperature range.
XC7A15T-1FTG256C
Xilinx
XC7A15T-1FTG256C by Xilinx is a Field Programmable Gate Array (FPGA) with 16640 logic cells and 1300 CLBs. It has a max clock frequency of 1098 MHz and is commonly used in applications requiring high-speed processing and programmability.
LFE5U-25F-6BG381I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
XC7K160T-1FFG676C
XC7K160T-1FFG676C by Xilinx is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It operates at supply voltages ranging from 0.97V to 3.3V and is used in applications requiring high-speed processing and programmable ICs.
EP3C25F324I7N
The Intel EP3C25F324I7N is a CMOS FPGA with 24624 logic cells and CLBs. It operates at max 472.5 MHz clock frequency, suitable for industrial applications requiring high-speed processing. With 215 inputs/outputs, it offers flexibility in designing complex digital circuits efficiently.
XC6SLX75-2FGG484I
Xilinx XC6SLX75-2FGG484I FPGA offers 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
10M16SAU169C8G
The Altera 10M16SAU169C8G is a field programmable gate array (FPGA) with 169 terminals in a square BGA package. It can operate between 0 to 85 degrees Celsius and is suitable for various applications that require FPGA functionality.
XC3S200AN-4FTG256C
Xilinx XC3S200AN-4FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 667 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC6VLX760-1FFG1760I
Xilinx XC6VLX760-1FFG1760I FPGA features 758784 logic cells, operates at max 1098 MHz clock frequency, and supports CMOS technology. Ideal for industrial applications requiring high-speed processing with a wide range of inputs/outputs and low power consumption.
M1A3P250-PQG208
M1A3P250-PQG208 by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at 350 MHz, it has a supply voltage range of 1.425V to 1.575V. Ideal for applications requiring high-speed processing in commercial-grade environments.
EP2C8F256C8N
EP2C8F256C8N by Intel is a FPGA with 8256 logic cells, 516 CLBs, and 182 inputs. It operates at a max clock frequency of 402.5 MHz and has a package style of grid array, making it suitable for high-performance computing applications requiring fast processing speeds in compact form factors.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCV300-6FGG456C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
XCV300-5FG456C
XCV300-4CSG144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; No. of Equivalent Gates: 322970; Nominal Supply Voltage (V): 2.5; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e1;
XCV300-4BG432C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;
XCV300-4BGG352C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;
XCV300-4CS144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Qualification: Not Qualified; Minimum Supply Voltage: 2.375 V; JESD-609 Code: e0; Finishing Of Terminal Used: TIN LEAD;
XCV300-4BGG256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCV300-4CSG144I
FIELD PROGRAMMABLE GATE ARRAY; No. of CLBs: 1536; Technology Used: CMOS; Nominal Supply Voltage (V): 2.5; Minimum Supply Voltage: 2.375 V; Qualification: Not Qualified;
XCV300-4BG256I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .6 ns;
XCV300-4BGG352I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XCV300-4BG432I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;
XCV300-4BGG432C
XCV300-4BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;
XCV300-4BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCV300-4BG352I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
XCV300-4BGG432I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Width: 40 mm;
XCV300-4BGG256I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCV300-4BG256C
XCV300-4BG352C
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