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XCKU035-1FBVA676I

Xilinx

XCKU035-1FBVA676I by Xilinx

Xilinx XCKU035-1FBVA676I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Utilizes a grid array package style with PLASTIC/EPOXY material.

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$1,795.115

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Overview

Unlock unlimited possibilities with the XCKU035-1FBVA676I by Xilinx, a top-of-the-line Field Programmable Gate Array that guarantees high performance and reliability. As a leading manufacturer in the industry, Xilinx ensures cutting-edge technology and innovation, making this FPGA ideal for a wide range of applications. From aerospace to telecommunications, this versatile device offers unmatched value, flexibility, and efficiency to customers looking to stay ahead of the curve. Elevate your projects with the XCKU035-1FBVA676I and experience the difference that quality craftsmanship and advanced features can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the FPGA, making it a reliable choice for various applications.

No. of Logic Cells: 444343

With a large number of logic cells, this FPGA offers ample capacity for complex designs and high-performance computing tasks.

Surface Mount: YES

Being surface mountable makes installation and integration of this FPGA easier and more convenient, saving time and effort during production.

Maximum Supply Voltage: 0.979 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making this FPGA energy-efficient.

No. of CLBs: 1700

Having 1700 Configurable Logic Blocks allows for versatile customization and flexibility in designing different functionalities within the FPGA.

No. of Inputs: 520

With a high number of inputs, this FPGA can handle a large amount of data simultaneously, making it suitable for complex data processing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on PCBs, making it easier to integrate this FPGA into compact electronic devices.

Form Of Terminal: BALL

The ball terminal form enables reliable connections and soldering, ensuring stable performance in various operating conditions.

Nominal Supply Voltage (V): 0.95

The consistent nominal supply voltage provides stable operation and reliable performance of the FPGA.

Power Supplies (V): 0.95

With a single power supply voltage of 0.95V, this FPGA simplifies the power management system and reduces the complexity of the design.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU035-1FBVA676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

444343

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

1700

Sub-Category:

Field Programmable Gate Arrays

Organization:

1700 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.71 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU035-1FBVA676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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