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XC6SLX100-2FGG676C

Xilinx

XC6SLX100-2FGG676C by Xilinx

Xilinx XC6SLX100-2FGG676C FPGA features 101261 logic cells, 7911 CLBs, and 480 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.

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Overview

Unlock limitless possibilities with the Xilinx XC6SLX100-2FGG676C Field Programmable Gate Array (FPGA). Manufactured by Xilinx, a renowned industry leader, this FPGA boasts 101261 logic cells, 7911 CLBs, and 480 inputs/outputs for unparalleled performance. From aerospace to telecommunications, this versatile device caters to a wide range of applications, offering customers the flexibility and customization they need to stay ahead in today's fast-paced technology landscape. Experience innovation like never before with the XC6SLX100-2FGG676C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a cost-effective and durable packaging solution for the FPGA, making it suitable for a wide range of applications.

No. of Logic Cells: 101261

With a high number of logic cells, this FPGA offers ample flexibility and scalability for complex designs.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, simplifying the manufacturing process and saving space.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 7911

The large number of Configurable Logic Blocks (CLBs) provides versatility in implementing different logic functions within the FPGA.

Technology Used: CMOS

The use of Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures high performance and low power consumption.

No. of Inputs: 480

With a high number of inputs, this FPGA can accommodate a variety of input signals for complex operations and processing.

Package Shape: SQUARE

The square shape of the package offers efficient use of space on a PCB, maximizing design flexibility.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process and ensures reliable connections for secure operation.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V provides a stable power source for the FPGA, maximizing performance and reliability.

Power Supplies (V): 1.2,2.5/3.3

The availability of multiple power supply options allows for compatibility with a variety of system configurations.

No. of Terminals: 676

The high number of terminals provides ample connectivity options for interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this product offers reconfigurability and adaptability for evolving design requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers a reliable and robust mounting solution for the FPGA, ensuring secure placement on the PCB.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for efficient operation at lower power levels, reducing overall energy consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions and ensure reliable performance.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for compact and efficient placement on the PCB, maximizing space utilization.

Maximum Combinatorial Delay of a CLB: 0.26 ns

The low maximum combinatorial delay of a Configurable Logic Block ensures fast processing and minimal latency in operations.

Organization: 7911 CLBS

The organized structure of 7911 CLBs provides a systematic layout for implementing complex logic functions efficiently.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making it versatile for various applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals offers corrosion resistance and reliable connections for long-term use.

Position Of Terminal: BOTTOM

The placement of terminals at the bottom of the package helps in easy integration onto the PCB and efficient routing of connections.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA can withstand moderate moisture exposure during transport and storage without impacting performance.

Maximum Seated Height: 2.44 mm

The low maximum seated height allows for slim and compact design configurations, ideal for space-constrained applications.

Width: 27 mm

The 27mm width of the FPGA offers a balance between compact size and ample connectivity options for diverse system integration.

Maximum Clock Frequency: 667 MHz

With a high maximum clock frequency, this FPGA can handle fast data processing and complex operations at high speeds.

No. of Outputs: 480

The high number of outputs allows for efficient signal processing and interfacing with other components in the system.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures reliable soldering and secure connections during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of 250°C ensures robust soldering and secure connections in varying manufacturing environments.

Length: 27 mm

The 27mm length provides a balance between compact form factor and ample space for connecting with other system components.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX100-2FGG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

101261

No. of Inputs:

480

No. of Outputs:

480

No. of CLBs:

7911

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

7911 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX100-2FGG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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