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SQ7415EN-T1-E3

Vishay Intertechnology

SQ7415EN-T1-E3 by Vishay Intertechnology

Vishay Intertechnology's SQ7415EN-T1-E3 is a P-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 30A IDM, and 0.065 ohm RDS(ON). With ENHANCEMENT MODE operation and DUAL terminals, it offers high performance in a SQUARE package with MATTE TIN finish.

Median Price

$1.012

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

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$1.012

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$1.012

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Vyrian

USA . 1,488 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

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$1.012

100+ parts

$0.992

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1,000

$1.012

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AZTECH Wire

Italy . 464 parts In-Stock

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$18.573

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Ampacity Inc.

Singapore . 206 parts In-Stock

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$32.050

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Infinite Electronics LLP (Excess)

. 14,974 parts In-Stock

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Kepictronics

USA . 5,490 parts In-Stock

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Overview

Elevate your power management solutions with the Vishay Intertechnology SQ7415EN-T1-E3 Power Field Effect Transistor. Crafted with precision and leading-edge technology, this P-CHANNEL FET offers unmatched efficiency and reliability for all your switching applications. With a high maximum pulsed drain current of 30 A and a low on-resistance of 0.065 ohm, this transistor ensures optimal performance even in demanding environments. Trust Vishay Intertechnology to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are ideal for high-side switching applications, providing efficient control of positive voltages.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient reverse voltage protection, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering fast and efficient performance.

Surface Mount: YES

Surface mount design enables easy integration onto PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 60 V

With a breakdown voltage of 60V, this FET can handle higher voltages without failure, ensuring robust operation.

Package Shape: SQUARE

Square package shape allows for a compact design, suitable for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control over the transistor's switching behavior.

Maximum Pulsed Drain Current (IDM): 30 A

High pulsed drain current capacity enables handling of brief surges in current, preventing damage to the transistor.

Maximum Drain Current (Abs) (ID): 3.6 A

Capable of handling continuous drain currents of up to 3.6A, suitable for various switching applications.

Maximum Power Dissipation (Abs): 3.8 W

With a maximum power dissipation of 3.8W, this FET can operate reliably under moderate power loads.

Package Style (Meter): SMALL OUTLINE

Small outline package style provides a compact form factor, advantageous in space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in transistor operation.

Maximum Operating Temperature: 175 °C

Capable of operating at temperatures up to 175°C, suitable for demanding industrial environments.

Transistor Element Material: SILICON

Silicon-based transistor element offers good performance characteristics and reliability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and resistance to corrosion, ensuring reliable connections.

Maximum Drain-Source On Resistance: 0.065 ohm

Low drain-source on resistance results in minimal power loss and efficient switching performance.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and simplifies circuit design.

Case Connection: DRAIN

Drain case connection simplifies the circuit layout and ensures efficient heat dissipation.

Technical Specifications

Power Field Effect Transistors (FET) SQ7415EN-T1-E3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

3.6 A

Maximum Drain Current (ID):

3.6 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-C5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SQ7415EN-T1-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

Category top products 20

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