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SIHFR430ATRL-GE3

Vishay Intertechnology

SIHFR430ATRL-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIHFR430ATRL-GE3 is a N-channel Power FET with 500V DS breakdown voltage, ideal for switching applications. It features 20A max pulsed drain current and 1.7ohm max drain-source resistance. With a package style of small outline and operating temperature up to 150°C, it offers high performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,348 parts In-Stock

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2,348

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 702 parts In-Stock

1+ parts

$1.770

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702

$1.770

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Corohmni

South Africa . 246 parts In-Stock

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$1.961

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246

$1.961

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AZTECH Wire

Italy . 740 parts In-Stock

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$12.478

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740

$12.478

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Ampacity Inc.

Singapore . 1,269 parts In-Stock

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$54.050

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1,269

$54.050

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Continental Prestige Electronics

USA . 5,619 parts In-Stock

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5,619

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Bastille Electronics

Australia . 3,975 parts In-Stock

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3,975

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Argo Parts USA

USA . 1,146 parts In-Stock

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Overview

Discover the powerful performance of the SIHFR430ATRL-GE3 by Vishay Intertechnology, a top-tier manufacturer known for its superior quality electronic components. This N-CHANNEL Power FET with a built-in diode is ideal for switching applications, offering a high breakdown voltage of 500V and maximum drain current of 5A. With a compact design and enhanced mode operation, this transistor provides reliable and efficient performance in various electronic systems. Trust in Vishay Intertechnology to deliver cutting-edge technology that exceeds expectations and enhances your projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protects the internal components of the transistor, making it a reliable choice for various applications.

Polarity or Channel Type

N-CHANNEL - N-channel transistors are known for their high performance and efficiency, making this product suitable for demanding applications.

Configuration

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and enhances the overall functionality of the transistor, making it a convenient option for users.

Transistor Application

SWITCHING - Designed specifically for switching applications, this transistor offers fast response times and high efficiency, making it ideal for power management systems.

Surface Mount

YES - The surface mount capability simplifies the assembly process and allows for space-efficient design, making this transistor suitable for compact electronic devices.

Minimum DS Breakdown Voltage

500 V - With a high breakdown voltage, this transistor can handle high voltages safely, making it a reliable choice for power applications.

Package Shape

RECTANGULAR - The rectangular shape allows for efficient placement on a circuit board, optimizing space and improving overall performance.

Terminal Form

GULL WING - The gull wing terminals provide secure connections and easy soldering, enhancing the reliability and longevity of the transistor.

Operating Mode

ENHANCEMENT MODE - Enhancement mode transistors offer precise control and high performance, making this product suitable for demanding applications.

Maximum Pulsed Drain Current (IDM)

20 A - With a high pulsed drain current rating, this transistor can handle sudden spikes in current, making it a reliable choice for dynamic applications.

Technical Specifications

Power Field Effect Transistors (FET) SIHFR430ATRL-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

130 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

1.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIHFR430ATRL-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

Category top products 20

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