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SIHFR430ATR-GE3

Vishay Intertechnology

SIHFR430ATR-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIHFR430ATR-GE3 is a N-channel FET with 500V DS breakdown voltage, ideal for switching applications. Features include 20A pulsed drain current, 130mJ avalanche energy rating, and 1.7 ohm max drain-source resistance. Its small outline package and high power dissipation make it suitable for enhancement mode operation in various electronic devices.

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1k+

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Vyrian

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Nova Conductors

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10

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USA . 4,553 parts In-Stock

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Corohmni

South Africa . 62 parts In-Stock

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$1.935

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AZTECH Wire

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Ampacity Inc.

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Bastille Electronics

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Overview

Unleash the power of cutting-edge technology with the SIHFR430ATR-GE3 by Vishay Intertechnology. This N-channel power field effect transistor offers unmatched quality and reliability, making it the top choice for switching applications. With a maximum power dissipation of 110W and a minimum DS breakdown voltage of 500V, this transistor delivers superior performance in a compact package. Trust Vishay Intertechnology to provide you with the best-in-class components for your electronic projects. Elevate your designs with the SIHFR430ATR-GE3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient conduction of current, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space.

Transistor Application: SWITCHING

Ideal for controlling power flow in electronic devices.

Surface Mount: YES

Facilitates easy installation on circuit boards.

Minimum DS Breakdown Voltage: 500 V

Ensures safe operation at high voltages.

Package Shape: RECTANGULAR

Allows for compact and efficient PCB layout.

Terminal Form: GULL WING

Provides secure connection to the PCB.

Operating Mode: ENHANCEMENT MODE

Allows for precise control over the transistor's operation.

Maximum Pulsed Drain Current (IDM): 20 A

Can handle high current pulses, suitable for power applications.

Avalanche Energy Rating (EAS): 130 mJ

Provides robustness in handling high-energy events.

Maximum Drain Current (Abs) (ID): 5 A

Suitable for medium-power applications.

No. of Terminals: 2

Simplifies connection and integration into circuits.

Maximum Power Dissipation (Abs): 110 W

Handles high power levels effectively.

Package Style (Meter): SMALL OUTLINE

Saves space in the design and allows for efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and reliability.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments.

Transistor Element Material: SILICON

Provides good thermal and electrical conductivity.

Terminal Finish: MATTE TIN

Ensures reliable solder connections.

Maximum Drain-Source On Resistance: 1.7 ohm

Provides low resistance for efficient power transfer.

Terminal Position: SINGLE

Simplifies installation and connection.

Case Connection: DRAIN

Allows for easy mounting and grounding.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during installation.

Peak Reflow Temperature °C: 260

Handles high-temperature soldering processes effectively.

Technical Specifications

Power Field Effect Transistors (FET) SIHFR430ATR-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

130 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

1.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIHFR430ATR-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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