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SIHFR430ATRR-GE3

Vishay Intertechnology

SIHFR430ATRR-GE3 by Vishay Intertechnology

SIHFR430ATRR-GE3 by Vishay Intertechnology is a N-channel power FET with a min DS breakdown voltage of 500V. It is used for switching applications and has a max pulsed drain current of 20A.

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Overview

Discover the SIHFR430ATRR-GE3 by Vishay Intertechnology, a high-quality Power Field Effect Transistor that offers exceptional performance and reliability. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Its small outline package and surface mount capability make it easy to install. The SIHFR430ATRR-GE3 can handle a maximum pulsed drain current of 20A and has a minimum DS breakdown voltage of 500V. With its metal-oxide semiconductor technology and silicon material, this transistor ensures efficient power management. Trust Vishay Intertechnology for innovative solutions that deliver value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and helps protect the internal components of the power FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

The N-channel polarity allows for efficient switching of high currents, making this power FET suitable for switching applications in power electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this single configuration power FET simplifies circuit design and offers convenient integration for applications that require reverse current protection.

Transistor Application: SWITCHING

The switching application capability of this power FET allows for fast and efficient control of power flow, making it ideal for applications requiring high-speed switching.

Surface Mount: YES

Being surface mount compatible, this power FET can be easily mounted on PCBs, facilitating automated assembly processes and saving valuable board space.

Minimum DS Breakdown Voltage: 500 V

With a minimum breakdown voltage of 500 V, this power FET can handle high voltage requirements safely and reliably.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, enabling easy integration into space-constrained designs.

Terminal Form: GULL WING

The gull wing terminal form allows for reliable solder connections during PCB assembly, ensuring robust electrical connections.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation of this power FET enables precise control of the transistor, making it suitable for applications that require low power consumption and high efficiency.

No. of Elements: 1

With a single element configuration, this power FET simplifies circuit design and reduces component count.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current capability of 20 A allows this power FET to handle short-term peak loads, making it suitable for applications with varying power requirements.

Avalanche Energy Rating (EAS): 130 mJ

The high avalanche energy rating of 130 mJ ensures reliable operation in applications where the power FET is subjected to transient voltage spikes or inductive load switching.

Maximum Drain Current (Abs) (ID): 5 A

With a maximum drain current rating of 5 A, this power FET can handle continuous current flow efficiently in a wide range of applications.

No. of Terminals: 2

The power FET's two-terminal configuration simplifies circuit layout and provides easy integration into various electronic systems.

Maximum Power Dissipation (Abs): 110 W

The high power dissipation capability of 110 W allows this power FET to handle applications with high power requirements, providing reliability and longevity.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact size, making it suitable for space-limited designs while maintaining excellent thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this power FET provides excellent electrical performance, low on-resistance, and high switching speeds for efficient power management.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this power FET can withstand high-temperature environments, ensuring reliable operation in a wide range of applications.

Transistor Element Material: SILICON

The silicon transistor element material offers excellent thermal conductivity and electrical characteristics, contributing to efficient performance and high reliability.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and excellent solderability, ensuring reliable electrical connections during PCB assembly.

Maximum Drain-Source On Resistance: 1.7 ohm

With a low maximum drain-source on resistance of 1.7 ohm, this power FET minimizes power losses and improves overall system efficiency.

Terminal Position: SINGLE

The single terminal position simplifies PCB layout and enables easier integration into existing circuit designs.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 indicates that this power FET has a low moisture absorption rate, making it suitable for moisture-sensitive applications.

Case Connection: DRAIN

The drain case connection configuration allows for efficient heat dissipation, enhancing the power FET's thermal performance and reliability.

Maximum Time At Peak Reflow Temperature (s): 30

This power FET can withstand a maximum time of 30 seconds at the peak reflow temperature during the soldering process, ensuring proper solder joint formation.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this power FET can withstand the high temperatures encountered during soldering, ensuring reliable assembly.

Technical Specifications

Power Field Effect Transistors (FET) SIHFR430ATRR-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

130 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

1.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIHFR430ATRR-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

Category top products 20

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