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SI9953DY-E3

Vishay Intertechnology

SI9953DY-E3 by Vishay Intertechnology

Vishay Intertechnology's SI9953DY-E3 is a P-CHANNEL FET with 20V DS Breakdown Voltage, 2.3A ID, and 0.25 ohm RDS(ON). Ideal for applications requiring small outline packages, such as portable electronics and power management systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 336 parts In-Stock

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336

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Nova Conductors

Japan . 74 parts In-Stock

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74

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 164 parts In-Stock

1+ parts

$0.313

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164

$0.313

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Aztec Data Supply Inc.

USA . 4,140 parts In-Stock

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$1.130

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4,140

$1.130

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AZTECH Wire

Italy . 524 parts In-Stock

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$5.975

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524

$5.975

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Ampacity Inc.

Singapore . 1,590 parts In-Stock

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$43.050

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1,590

$43.050

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Continental Prestige Electronics

USA . 5,359 parts In-Stock

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5,359

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Argo Parts USA

USA . 2,046 parts In-Stock

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2,046

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Upgrade your electronic devices with the high-quality SI9953DY-E3 P-Channel Small Signal Field Effect Transistor by Vishay Intertechnology. Designed with cutting-edge technology, this transistor offers enhanced performance and reliability for a wide range of applications. With its dual elements and built-in diode, this transistor provides superior functionality while maintaining a compact size. Trust Vishay Intertechnology to deliver top-notch products that meet your needs and exceed your expectations. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the transistor, ensuring reliable operation over time.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer lower resistance and higher current capabilities compared to N-channel FETs, making them suitable for various applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The integrated diode provides reverse current protection and the separate elements allow for versatile circuit design possibilities.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages without breakdown, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor for easy mounting and compatibility with existing designs.

Terminal Form: GULL WING

Gull wing terminals offer secure connections and easy soldering onto circuit boards, ensuring reliable electrical contacts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, allowing for precise control and efficient operation in various circuit configurations.

No. of Elements: 2

Having two elements in one package provides design flexibility and potential cost savings compared to using multiple individual transistors.

No. of Terminals: 8

The eight terminals offer multiple connection points for versatile circuit design and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and enhances thermal performance for improved reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance characteristics, low power consumption, and high reliability for various applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its high thermal conductivity, electrical performance, and reliability in electronic devices.

Terminal Finish: Matte Tin (Sn)

Matte tin finish on the terminals provides good solderability and resistance to environmental factors, ensuring long-term connectivity and performance.

Maximum Drain Current (ID): 2.3 A

With a maximum drain current of 2.3A, this FET can handle higher current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.25 ohm

The low on-resistance of 0.25 ohms minimizes power loss and heat generation in the FET, contributing to overall efficiency in circuit operation.

Terminal Position: DUAL

Dual terminal position allows for ease of connection and flexibility in circuit design, accommodating various mounting orientations and configurations.

Technical Specifications

Small Signal Field Effect Transistors (FET) SI9953DY-E3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.3 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

SI9953DY-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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