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SI7317DN-T1-GE3

Vishay Intertechnology

SI7317DN-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SI7317DN-T1-GE3 is a P-channel FET with 150V DS breakdown voltage, 2A IDM, and 1.3 ohm RDS(on). Ideal for switching applications, it features a built-in diode in a small outline package suitable for surface mount technology.

Median Price

$0.763

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 3,000 parts In-Stock

1+ parts

$0.656

100+ parts

-

1k+ parts

$0.632

10k+ parts

$0.504

3,000

$0.656

-

$0.632

$0.504

Arrow

USA . 2,470 parts In-Stock

1+ parts

$0.763

100+ parts

-

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2,470

$0.763

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Chip1Stop

Japan . 2,470 parts In-Stock

1+ parts

$0.791

100+ parts

-

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10k+ parts

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2,470

$0.791

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Mouser Electronics

USA . 27,208 parts In-Stock

1+ parts

$1.310

100+ parts

$0.615

1k+ parts

$0.478

10k+ parts

$0.428

27,208

$1.310

$0.615

$0.478

$0.428

DigiKey

USA . 16,589 parts In-Stock

1+ parts

$1.710

100+ parts

$0.725

1k+ parts

$0.523

10k+ parts

$0.422

16,589

$1.710

$0.725

$0.523

$0.422

Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

-

100+ parts

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$0.450

6,000

-

-

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$0.450

TTI Europe

Germany . 6,000 parts In-Stock

1+ parts

-

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10k+ parts

$0.398

6,000

-

-

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$0.398

Verical

USA . 2,470 parts In-Stock

1+ parts

-

100+ parts

$0.763

1k+ parts

-

10k+ parts

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2,470

-

$0.763

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 23,744 parts In-Stock

1+ parts

$0.398

100+ parts

-

1k+ parts

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23,744

$0.398

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.557

6,000

-

-

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$0.557

Cyclops Electronics Ltd

UK . 4,900 parts In-Stock

1+ parts

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4,900

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

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750

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Speed Components Ltd

Israel . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,430 parts In-Stock

1+ parts

$0.338

100+ parts

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1k+ parts

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15,430

$0.338

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Corohmni

South Africa . 87 parts In-Stock

1+ parts

$0.557

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87

$0.557

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Semicontronic

India . 15,279 parts In-Stock

1+ parts

$0.740

100+ parts

$0.722

1k+ parts

$0.718

10k+ parts

-

15,279

$0.740

$0.722

$0.718

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RC Electronics

USA . 83,391 parts In-Stock

1+ parts

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83,391

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QUARKTWIN TECHNOLOGY LTD

USA . 9,702 parts In-Stock

1+ parts

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9,702

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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Continental Prestige Electronics

USA . 4,581 parts In-Stock

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4,581

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Argo Parts USA

USA . 3,671 parts In-Stock

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3,671

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Perfect Parts

USA . 3,360 parts In-Stock

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3,360

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Glotronic Ltd.

UK . 2,379 parts In-Stock

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2,379

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100

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Overview

Unleash the power of cutting-edge technology with the SI7317DN-T1-GE3 by Vishay Intertechnology. Crafted with precision and expertise, this P-Channel Power FET offers unparalleled performance in switching applications. With a high DS breakdown voltage and built-in diode, this transistor provides reliability and efficiency like no other. Whether you're looking to enhance your electronic devices or boost your project capabilities, the SI7317DN-T1-GE3 delivers exceptional value and benefits that exceed expectations. Elevate your designs with Vishay Intertechnology's top-notch quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where P-channel FETs are required.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the FET.

Transistor Application: SWITCHING

Ideal for use in switching applications, ensuring efficient operation.

Surface Mount: YES

Enables easy and secure mounting on circuit boards.

Minimum DS Breakdown Voltage: 150 V

Provides high breakdown voltage for reliable operation in various voltage conditions.

Package Shape: SQUARE

Allows for compact and efficient placement on circuit boards.

Terminal Form: C BEND

Facilitates secure and reliable connections during installation.

Operating Mode: ENHANCEMENT MODE

Provides controlled switching behavior for better performance.

Maximum Pulsed Drain Current (IDM): 2 A

Capable of handling high current pulses for demanding applications.

Avalanche Energy Rating (EAS): 0.8 mJ

Offers protection against avalanche breakdown events.

No. of Terminals: 5

Provides necessary connections for the FET to function effectively.

Package Style (Meter): SMALL OUTLINE

Ensures compatibility with standard mounting methods and PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers reliable and efficient performance in power management applications.

Transistor Element Material: SILICON

Offers good electrical properties for power switching applications.

Terminal Finish: MATTE TIN

Provides a reliable conductivity and resistance to corrosion.

Maximum Drain Current (ID): 1.1 A

Capable of handling moderate continuous drain currents.

Maximum Drain-Source On Resistance: 1.3 ohm

Ensures low resistance for efficient power transfer.

Terminal Position: DUAL

Facilitates easy connection in various circuit configurations.

Case Connection: DRAIN

Provides a common connection point for the drain terminal.

Maximum Time At Peak Reflow Temperature (s): 30

Defines the maximum time the FET can withstand peak reflow temperatures during installation.

Peak Reflow Temperature °C: 260

Specifies the peak reflow temperature for soldering the FET onto the PCB.

Technical Specifications

Power Field Effect Transistors (FET) SI7317DN-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

1.1 A

Maximum Drain-Source On Resistance:

1.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-C5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

2 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI7317DN-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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