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SI7309DN-T1-E3

Vishay Intertechnology

SI7309DN-T1-E3 by Vishay Intertechnology

Vishay Intertechnology's SI7309DN-T1-E3 is a P-CHANNEL FET for switching applications. It features a 60V DS breakdown voltage, 20A pulsed drain current, and 0.115 ohm max on-resistance. With a small outline package style and matte tin finish, it operates at up to 150°C making it suitable for various power management tasks.

Median Price

$0.378

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 18,662 parts In-Stock

1+ parts

$1.570

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$0.662

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$0.474

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$0.435

18,662

$1.570

$0.662

$0.474

$0.435

DigiKey

USA . 10,650 parts In-Stock

1+ parts

$1.570

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$0.661

1k+ parts

$0.474

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$0.375

10,650

$1.570

$0.661

$0.474

$0.375

TTI Europe

Germany . 27,000 parts In-Stock

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$0.384

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$0.384

Avnet

USA . 15,000 parts In-Stock

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$0.369

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$0.369

TTI

USA . 12,000 parts In-Stock

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$0.369

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$0.369

Arrow

USA . 3,000 parts In-Stock

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$0.375

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$0.375

Verical

USA . 3,000 parts In-Stock

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$0.354

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$0.354

Chip1Stop

Japan . 3,000 parts In-Stock

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$0.381

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$0.381

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Vyrian

USA . 59,391 parts In-Stock

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$0.320

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NAC Semi

USA . 3,000 parts In-Stock

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$0.522

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Nova Conductors

Japan . 600 parts In-Stock

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Ampacity Inc.

Singapore . 12,228 parts In-Stock

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$0.301

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Corohmni

South Africa . 229 parts In-Stock

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$1.667

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RC Electronics

USA . 72,171 parts In-Stock

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Perfect Parts

USA . 6,898 parts In-Stock

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Kepictronics

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Netroflash

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Overview

Discover the Vishay Intertechnology SI7309DN-T1-E3, a top-quality P-CHANNEL Power FET with a built-in diode for enhanced performance. Perfect for switching applications, this transistor offers a maximum pulsed drain current of 20 A and a minimum DS breakdown voltage of 60 V. With a compact square package style and matte tin terminal finish, this enhancement mode transistor is designed to optimize power dissipation and efficiency. Trust Vishay's cutting-edge technology and reliability for all your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-Channel FETs are known for their low on-resistance and high current-carrying capability, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse polarity and inductive kickback, increasing the reliability of the overall system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low switching losses, making it efficient in power control.

Surface Mount: YES

Surface mount technology provides space-saving benefits and allows for higher component density on a circuit board.

Maximum Power Dissipation (Abs): 19.8 W

With a high maximum power dissipation rating, this FET can handle significant heat dissipation, ensuring reliable performance under heavy loads.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows this FET to operate reliably in harsh environmental conditions without degradation in performance.

Maximum Drain-Source On Resistance: 0.115 ohm

With a low on-resistance, this FET minimizes power loss and heat generation during operation, resulting in higher efficiency.

Technical Specifications

Power Field Effect Transistors (FET) SI7309DN-T1-E3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

11 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-C5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI7309DN-T1-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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