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2N6661JTX02

Vishay Intertechnology

2N6661JTX02 by Vishay Intertechnology

Vishay Intertechnology's 2N6661JTX02 is a N-CHANNEL FET with 90V DS Breakdown Voltage, 0.86A Drain Current, and 6.25W Power Dissipation. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE in a ROUND package with METAL body.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,821 parts In-Stock

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VNN

France . 3,017 parts In-Stock

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Bristol Electronics

USA . 93 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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AZTECH Wire

Italy . 566 parts In-Stock

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$18.421

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Ampacity Inc.

Singapore . 573 parts In-Stock

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$64.050

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Perfect Parts

USA . 941 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Looking for a reliable Small Signal Field Effect Transistor? Look no further than the 2N6661JTX02 by Vishay Intertechnology. With a single configuration and built-in diode, this N-CHANNEL transistor is perfect for switching applications. Its high-quality metal package body material ensures durability while its maximum power dissipation of 6.25W guarantees optimal performance. Trust Vishay Intertechnology to deliver value and reliability with every product, making the 2N6661JTX02 the perfect choice for your electronic projects. Unlock the potential of your designs with this high-quality transistor today!

Feature Benefit Bullets

Package Body Material: METAL

Metal packaging provides durability and efficient heat dissipation, ensuring the reliability and long lifespan of the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel transistors, making this a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect the transistor from reverse voltage spikes, enhancing its overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can rapidly switch between on and off states with minimal power loss, making it ideal for efficient power management in circuits.

Minimum DS Breakdown Voltage: 90 V

The high breakdown voltage allows this transistor to withstand higher voltage levels, increasing its versatility and potential applications.

Maximum Drain Current (ID): 0.86 A

With a high maximum drain current capability, this transistor can handle relatively high current loads, making it suitable for various power applications.

Maximum Power Dissipation (Abs): 6.25 W

The high maximum power dissipation ensures that the transistor can handle significant power levels without overheating, making it reliable in demanding operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this transistor a good choice for applications requiring precise and stable performance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without compromising its performance, ensuring reliable operation in harsh environments.

Maximum Drain-Source On Resistance: 4 ohm

The low drain-source on resistance results in minimal power loss and heat generation when the transistor is conducting, contributing to high efficiency in circuit operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N6661JTX02 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Additional Features:

LOW THRESHOLD, HIGH RELIABILITY, LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

90 V

Maximum Drain Current (Abs) (ID):

.86 A

Maximum Drain Current (ID):

.86 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-205AD

JESD-30 Code:

O-MBCY-W3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N6661JTX02 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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