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GT50J301

Toshiba

GT50J301 by Toshiba

Toshiba GT50J301 is an N-CHANNEL IGBT transistor with 600V VCEsat, ideal for POWER CONTROL applications. Features include 50A IC, 2.7V VCEsat, and 300ns fall time. Its PLASTIC/EPOXY package with THROUGH-HOLE terminals ensures efficient heat dissipation and easy installation in various power control systems.

Median Price

$16.650

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Advanced Electronics

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Overview

Upgrade your power control systems with the Toshiba GT50J301 Insulated Gate Bipolar Transistor. Manufactured by industry leader Toshiba, this N-CHANNEL transistor offers a single configuration with a built-in diode, making it perfect for a wide range of applications. With a maximum VCEsat of 2.7V and a maximum collector current of 50A, this transistor provides reliable performance and efficient power dissipation up to 200W. Trust in Toshiba's quality and innovation for all your power control needs with the GT50J301.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient freewheeling of inductive loads, reducing the need for external components and simplifying the overall circuit design.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, providing efficient and precise control over the flow of power in the circuit.

Maximum VCEsat: 2.7 V

Low VCEsat value indicates low saturation voltage, leading to reduced power dissipation and improved efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into the circuit board, saving space and facilitating efficient thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide reliable and secure connections, ideal for high-power applications where strong solder joints are essential.

Maximum Fall Time (tf): 300 ns

Fast fall time enables quick turn-off of the IGBT, reducing switching losses and improving overall performance in high-frequency applications.

Nominal Turn Off Time (toff): 500 ns

Quick turn-off time ensures efficient switching transitions, minimizing heat generation and improving the reliability of the IGBT.

No. of Terminals: 3

Three terminals provide necessary connections for the gate, collector, and emitter, facilitating simple and effective circuit layouts.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating, ensuring reliable operation in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure mounting and efficient heat dissipation, suitable for high-power applications with thermal management requirements.

Maximum Power Dissipation Ambient: 200 W

Sufficient power dissipation capacity even in ambient conditions ensures stable operation of the IGBT under varying environmental temperatures.

Maximum Operating Temperature: 150 °C

High maximum operating temperature rating allows the IGBT to withstand elevated temperatures, making it suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 600 V

High maximum voltage rating enables the IGBT to handle high voltage levels, making it suitable for high-power switching applications.

Transistor Element Material: SILICON

Silicon-based construction provides good electrical performance and high reliability, ensuring long-term operation in critical applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage rating allows for safe and reliable gate control, ensuring precise switching behavior in the IGBT.

Maximum Collector Current (IC): 50 A

High collector current rating enables the IGBT to handle large current flows, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 8 V

Low threshold voltage ensures efficient gate control and fast switching performance, improving overall efficiency of the IGBT.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and secure connections, ensuring robust electrical connections in the IGBT.

Terminal Position: SINGLE

Single terminal position simplifies the connection setup and ensures correct orientation during installation, preventing errors in circuit assembly.

Case Connection: COLLECTOR

Collector case connection facilitates easy heat dissipation and efficient thermal management, improving the overall reliability and performance of the IGBT.

Nominal Turn On Time (ton): 400 ns

Fast turn-on time allows for quick response in switching operations, reducing losses and improving efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) GT50J301 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Toshiba

Specs

Additional Features:

HIGH SPEED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

300 ns

Maximum Gate-Emitter Threshold Voltage:

8 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

200 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

500 ns

Nominal Turn On Time (ton):

400 ns

Maximum VCEsat:

2.7 V

Trade Compliance

GT50J301 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Toshiba

TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.

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