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XRM48L952ZWTT

Texas Instruments

XRM48L952ZWTT by Texas Instruments

XRM48L952ZWTT by Texas Instruments is a 32-bit microcontroller with 262144 RAM Bytes and 3145728 ROM Words. It operates b/w -40 to 105 °C, suitable for industrial applications requiring high-speed processing and low power consumption. The package style is GRID ARRAY, FINE PITCH, making it ideal for surface mount designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,183 parts In-Stock

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6,183

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Digiode

USA . 744 parts In-Stock

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744

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Distributors (Availability)

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AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$16.889

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-

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469

$16.889

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One Stop Electronics

USA . 1,288 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 405 parts In-Stock

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$64.471

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405

$64.471

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ChromeModa Solutions

Germany . 5,042 parts In-Stock

1+ parts

$72.439

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$59.400

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5,042

$72.439

$59.400

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IDEA Electronic Components Group

UK . 1,182 parts In-Stock

1+ parts

$72.439

100+ parts

$68.817

1k+ parts

$65.195

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1,182

$72.439

$68.817

$65.195

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Microchip USA

USA . 1,817 parts In-Stock

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1,817

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Corphita

USA . 1,136 parts In-Stock

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DigiPath Technology Company

USA . 576 parts In-Stock

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$65.311

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576

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$65.311

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Overview

Unlock the power of innovation with the XRM48L952ZWTT by Texas Instruments, a top-of-the-line microcontroller designed to elevate your projects to new heights. With a reputation for excellence, Texas Instruments delivers unparalleled quality and reliability in every product they create. This microcontroller is perfect for a wide range of applications, offering customers exceptional value and performance. Experience the benefits of cutting-edge technology with the XRM48L952ZWTT and see why Texas Instruments is the industry leader in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making it suitable for various environments and applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high performance and efficiency for complex computing tasks.

Power Supplies (V): 1.2,3.3

Support for multiple power supplies allows for flexibility in design and energy efficiency.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provides high density integration and space-saving design.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications and harsh environments.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers high performance and real-time processing capabilities, making it ideal for applications requiring precise timing.

RAM Bytes: 262144

With a large RAM capacity of 262144 bytes, this microcontroller can handle complex data processing and multitasking effectively.

Technology: CMOS

The CMOS technology ensures low power consumption and high speed operation, improving overall efficiency.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick updates to the software, enhancing flexibility and adaptability.

Speed: 220 rpm

The high speed of 220 rpm enables fast and responsive performance in real-time applications.

Technical Specifications

Microcontrollers XRM48L952ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

CORTEX-R4F

JESD-30 Code:

S-PBGA-B337

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Speed:

220 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

XRM48L952ZWTT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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