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XRM44L520APZT

Texas Instruments

XRM44L520APZT by Texas Instruments

XRM44L520APZT by Texas Instruments is a 32-bit microcontroller with 786432 ROM words and 131072 RAM bytes. It operates at a max clock frequency of 80 MHz, has 24-Ch 12-Bit ADC channels, and offers connectivity via I2C and SPI. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,874 parts In-Stock

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Digiode

USA . 1,427 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 429 parts In-Stock

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$8.251

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429

$8.251

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Corohmni

South Africa . 212 parts In-Stock

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$14.984

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212

$14.984

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One Stop Electronics

USA . 1,243 parts In-Stock

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$17.000

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$17.000

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Ampacity Inc.

Singapore . 350 parts In-Stock

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$27.000

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350

$27.000

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Parana Technologies

USA . 2,305 parts In-Stock

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$42.237

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$42.237

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ChromeModa Solutions

Germany . 1,359 parts In-Stock

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$47.457

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$38.915

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$47.457

$38.915

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IDEA Electronic Components Group

UK . 397 parts In-Stock

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$47.457

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$45.084

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$42.711

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397

$47.457

$45.084

$42.711

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Continental Prestige Electronics

USA . 2,216 parts In-Stock

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Microchip USA

USA . 1,927 parts In-Stock

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Corphita

USA . 1,716 parts In-Stock

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Argo Parts USA

USA . 1,482 parts In-Stock

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DigiPath Technology Company

USA . 1,451 parts In-Stock

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$42.787

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$42.787

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Elevate your projects with the XRM44L520APZT by Texas Instruments, a top-tier microcontroller that delivers unmatched quality and reliability. With a wide range of applications in various industries, this cutting-edge device offers customers unrivaled value and benefits. From its high-performance technology to its versatility and advanced features, the XRM44L520APZT is designed to exceed expectations and empower innovation. Trust in Texas Instruments for exceptional products that elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to physical damage, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount design allows for easy and efficient soldering onto PCBs, simplifying the manufacturing process.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller, reducing the risk of damage due to overvoltage.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space, enabling compact and space-saving designs.

Bit Size: 32

32-bit architecture provides high computational power and performance for demanding applications.

No. of Terminals: 100

High number of terminals allows for a wide range of connectivity options and peripherals to be interfaced with the microcontroller.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast processing speeds, making the microcontroller suitable for applications requiring real-time data processing.

RAM Bytes: 131072

Large RAM size allows for efficient data processing and multitasking capabilities, enhancing the performance of the microcontroller.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with 12-bit resolution provide accurate and high-quality analog-to-digital conversion, essential for sensor interfacing and data acquisition.

Connectivity: I2C, SPI

Support for I2C and SPI communication protocols ensures compatibility with a wide range of external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers XRM44L520APZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

45

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

I2C, SPI

Peripherals:

DMA(16), POR, PWM(8), TIMER(22), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XRM44L520APZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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