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XRM44L920PGET

Texas Instruments

XRM44L920PGET by Texas Instruments

Texas Instruments XRM44L920PGET microcontroller features 32-bit architecture, 1048576 ROM words, and 64K data EEPROM. With 24-Ch 12-Bit ADCs, it offers CAN(3), I2C, SCI(2), SPI(4) connectivity for industrial applications requiring up to 80 MHz clock frequency. The low-profile package with GULL WING terminals suits space-constrained designs needing high-speed performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,996 parts In-Stock

1+ parts

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3,996

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Digiode

USA . 2,699 parts In-Stock

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2,699

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Distributors (Availability)

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AZTECH Wire

Italy . 643 parts In-Stock

1+ parts

$14.987

100+ parts

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643

$14.987

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Parana Technologies

USA . 557 parts In-Stock

1+ parts

$27.400

100+ parts

-

1k+ parts

$35.446

10k+ parts

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557

$27.400

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$35.446

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ChromeModa Solutions

Germany . 4,026 parts In-Stock

1+ parts

$30.787

100+ parts

$25.245

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4,026

$30.787

$25.245

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IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$30.787

100+ parts

$29.248

1k+ parts

$27.708

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1,966

$30.787

$29.248

$27.708

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One Stop Electronics

USA . 1,358 parts In-Stock

1+ parts

$34.000

100+ parts

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1,358

$34.000

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Corphita

USA . 2,031 parts In-Stock

1+ parts

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2,031

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DigiPath Technology Company

USA . 1,735 parts In-Stock

1+ parts

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100+ parts

$27.758

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1,735

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$27.758

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Overview

Experience the next level of performance with the XRM44L920PGET by Texas Instruments, a leading manufacturer in the industry. This microcontroller offers unparalleled quality and reliability, making it perfect for a wide range of applications. From automotive to industrial automation, this product delivers exceptional value with its advanced features and innovative design. Trust Texas Instruments to provide you with cutting-edge technology that exceeds expectations. Choose the XRM44L920PGET for superior performance and unmatched benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a long lifespan.

Surface Mount: YES

Allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power requirements while maintaining stable operation.

Package Shape: SQUARE

Facilitates easy placement and alignment during manufacturing processes.

Bit Size: 32

Offers high processing capability for complex tasks and calculations.

No. of Terminals: 144

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact designs and efficient use of space in electronic devices.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at lower voltage levels, conserving power.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in harsh cold environments without performance degradation.

ADC Channels: YES

Allows for analog sensor inputs and data conversion, expanding functionality.

DMA Channels: YES

Facilitates data transfer and processing without CPU intervention, improving efficiency.

Terminal Position: QUAD

Enables convenient and organized wiring connections for peripheral devices.

ROM Words: 1048576

Ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Saves space in compact electronic designs with low-profile components.

Width: 20 mm

Compact form factor for easy integration into various electronic systems.

Data EEPROM Size: 64K

Allows for non-volatile data storage for critical system information.

Peripherals: DMA(16), POR, PWM(14), TIMER(41), WDT

Offers a wide range of built-in peripherals for versatile functionality.

Maximum Clock Frequency: 80 MHz

High clock speed for fast processing of data and real-time applications.

Length: 20 mm

Balanced form factor for efficient board layout and component arrangement.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications with demanding environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and high-performance operation.

RAM Bytes: 131072

Sufficient RAM capacity for data storage and manipulation during operation.

Technology: CMOS

Low-power CMOS technology for energy-efficient operation and extended battery life.

Terminal Form: GULL WING

Provides secure and reliable connections for robust performance in various applications.

Analog To Digital Convertors: 24-Ch 12-Bit

High-resolution ADCs for accurate conversion of analog signals to digital data.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for stable and efficient operation of the microcontroller.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices.

Connectivity: CAN(3), I2C, SCI(2), SPI(4)

Versatile communication interfaces for seamless integration with external devices.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of software and firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density mounting and space-saving designs.

Speed: 200 rpm

High-speed operation for fast data processing and real-time control applications.

On Chip Program ROM Width: 8

Efficient use of on-chip memory for storing program instructions.

No. of I/O Lines: 64

Sufficient I/O options for interfacing with external peripherals and sensors.

Technical Specifications

Microcontrollers XRM44L920PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(4)

Peripherals:

DMA(16), POR, PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XRM44L920PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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