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XRM44L520PGET

Texas Instruments

XRM44L520PGET by Texas Instruments

Texas Instruments XRM44L520PGET microcontroller features 32-bit architecture, 786432 ROM words, and 131072 bytes of RAM. With 24-Ch 12-Bit ADCs, it is ideal for industrial applications requiring high-speed processing up to 80 MHz and extensive peripheral support including CAN, I2C, LIN, MIBSPI, SCI, and SPI connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,881 parts In-Stock

1+ parts

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4,881

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Vyrian

USA . 3,686 parts In-Stock

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3,686

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 167 parts In-Stock

1+ parts

$17.723

100+ parts

-

1k+ parts

$17.905

10k+ parts

-

167

$17.723

-

$17.905

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$18.752

100+ parts

-

1k+ parts

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423

$18.752

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DigiPath Technology Company

USA . 2,123 parts In-Stock

1+ parts

$19.515

100+ parts

-

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2,123

$19.515

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ChromeModa Solutions

Germany . 5,616 parts In-Stock

1+ parts

$19.913

100+ parts

$16.329

1k+ parts

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10k+ parts

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5,616

$19.913

$16.329

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IDEA Electronic Components Group

UK . 705 parts In-Stock

1+ parts

$19.913

100+ parts

$18.917

1k+ parts

$17.922

10k+ parts

-

705

$19.913

$18.917

$17.922

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One Stop Electronics

USA . 954 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

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954

$29.000

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Corphita

USA . 2,126 parts In-Stock

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2,126

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Overview

Unleash the power of innovation with the XRM44L520PGET microcontroller by Texas Instruments. Designed with precision and quality in mind, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this microcontroller is the ultimate tool for creating cutting-edge technology. With advanced features like analog to digital converters and PWM channels, customers can bring their ideas to life with ease. Trust in Texas Instruments to deliver top-notch products that exceed expectations every time. Elevate your projects with the XRM44L520PGET microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, making it suitable for various applications.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options, making the microcontroller compatible with different systems.

Package Shape: SQUARE

The square package shape allows for efficient use of space, making it easier to integrate the microcontroller into different designs.

Bit Size: 32

The 32-bit size provides enhanced processing capabilities, allowing for complex calculations and tasks to be performed efficiently.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options and interfaces, making the microcontroller versatile in different applications.

ROM Words: 786432

The large ROM size allows for storing a significant amount of program data, enabling the microcontroller to handle complex programs and algorithms effectively.

RAM Bytes: 131072

With a large RAM size, the microcontroller can store and access data quickly, improving overall performance and efficiency.

Analog To Digital Convertors: 24-Ch 12-Bit

Having 24 analog to digital converters with 12-bit resolution allows for accurate and precise conversion of analog signals to digital data, essential for many applications.

Technical Specifications

Microcontrollers XRM44L520PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

Peripherals:

CAP(6), DMA(16), POR, PWM(14), QEP(2), TIMER(40), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XRM44L520PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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