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XRM48L950PGET

Texas Instruments

XRM48L950PGET by Texas Instruments

XRM48L950PGET by Texas Instruments is a 32-bit microcontroller with 16-bit address and external data bus width. It operates at a max clock frequency of 80 MHz, suitable for industrial applications requiring high-speed processing. With features like ADC and DMA channels, it offers versatile functionality in a compact package ideal for space-constrained designs.

Median Price

$27.810

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11 parts In-Stock

1+ parts

$27.810

100+ parts

$27.250

1k+ parts

$26.700

10k+ parts

-

11

$27.810

$27.250

$26.700

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,804 parts In-Stock

1+ parts

-

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8,804

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Digiode

USA . 1,705 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,705

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-

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-

Distributors (Availability)

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AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$17.528

100+ parts

-

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614

$17.528

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One Stop Electronics

USA . 921 parts In-Stock

1+ parts

$23.000

100+ parts

-

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921

$23.000

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Ampacity Inc.

Singapore . 262 parts In-Stock

1+ parts

$24.000

100+ parts

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262

$24.000

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Parana Technologies

USA . 2,263 parts In-Stock

1+ parts

$68.523

100+ parts

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2,263

$68.523

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ChromeModa Solutions

Germany . 4,784 parts In-Stock

1+ parts

$76.992

100+ parts

$63.133

1k+ parts

-

10k+ parts

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4,784

$76.992

$63.133

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IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$76.992

100+ parts

$73.142

1k+ parts

$69.293

10k+ parts

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2,329

$76.992

$73.142

$69.293

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QUARKTWIN TECHNOLOGY LTD

USA . 13,669 parts In-Stock

1+ parts

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13,669

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Corphita

USA . 3,711 parts In-Stock

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3,711

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Microchip USA

USA . 926 parts In-Stock

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926

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DigiPath Technology Company

USA . 580 parts In-Stock

1+ parts

-

100+ parts

$69.416

1k+ parts

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10k+ parts

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580

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$69.416

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Overview

Unleash the power of innovation with the XRM48L950PGET by Texas Instruments. As a leader in the industry, Texas Instruments sets the standard for quality and reliability in microcontrollers. This versatile device is perfect for a wide range of applications, offering advanced features such as ADC and DMA channels. With a maximum clock frequency of 80 MHz and flash ROM programmability, the XRM48L950PGET delivers unparalleled performance and flexibility. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and drives your projects to success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability of the product, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability makes the product easy to integrate and saves space on the circuit board.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply options and can support a variety of peripherals.

Address Bus Width: 16

16-bit address bus width enables the microcontroller to access a larger memory space efficiently.

Package Shape: SQUARE

Square package shape is convenient for placement on the PCB and allows for efficient use of board space.

Bit Size: 32

32-bit architecture provides enhanced processing capability and performance for complex tasks.

No. of Terminals: 144

Having 144 terminals allows for a wide range of input/output connections, making the microcontroller versatile in various applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, fine pitch package style provides a compact and efficient design for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage ensures energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows the microcontroller to operate in harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the microcontroller to function in extreme cold conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals, expanding the microcontroller's capabilities.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce the workload on the CPU, enhancing overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture delivers high performance and power efficiency, making the microcontroller suitable for embedded applications.

Maximum Clock Frequency: 80 MHz

High maximum clock frequency enables fast processing speed for time-critical operations and real-time applications.

ROM Programmability: FLASH

Flash memory programmability allows for flexibility in firmware updates and customization of the microcontroller's functionality.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller is suitable for reflow soldering processes, ensuring reliability in manufacturing.

Technical Specifications

Microcontrollers XRM48L950PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XRM48L950PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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