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XRM44L920PZT

Texas Instruments

XRM44L920PZT by Texas Instruments

XRM44L920PZT by Texas Instruments is a 32-bit microcontroller with 1048576 ROM words, 131072 RAM bytes, and 16-Ch 12-Bit ADC channels. It operates at a max clock frequency of 80 MHz and features peripherals like DMA(16), PWM(8), TIMER(22). Ideal for industrial applications requiring high-speed data processing and connectivity via CAN(2), SCI, SPI(3) interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,576 parts In-Stock

1+ parts

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7,576

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Digiode

USA . 4,278 parts In-Stock

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4,278

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 474 parts In-Stock

1+ parts

$12.000

100+ parts

-

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474

$12.000

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AZTECH Wire

Italy . 876 parts In-Stock

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$13.547

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876

$13.547

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Parana Technologies

USA . 738 parts In-Stock

1+ parts

$25.614

100+ parts

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$26.226

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738

$25.614

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$26.226

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DigiPath Technology Company

USA . 1,290 parts In-Stock

1+ parts

$28.204

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1,290

$28.204

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ChromeModa Solutions

Germany . 2,542 parts In-Stock

1+ parts

$28.780

100+ parts

$23.600

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2,542

$28.780

$23.600

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IDEA Electronic Components Group

UK . 2,196 parts In-Stock

1+ parts

$28.780

100+ parts

$27.341

1k+ parts

$25.902

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2,196

$28.780

$27.341

$25.902

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Corphita

USA . 4,035 parts In-Stock

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4,035

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Overview

Unleash the power of innovation with the XRM44L920PZT microcontroller by Texas Instruments. Designed with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial automation, this microcontroller delivers seamless connectivity and advanced features to optimize your projects. Elevate your designs with the quality and excellence that only Texas Instruments can provide. Experience the difference with the XRM44L920PZT and unlock endless possibilities for your next breakthrough.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring a longer lifespan for the microcontroller.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32V allows for flexibility in power supply options and compatibility with a wide range of power sources.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex tasks and processes efficiently, providing high performance and accuracy.

ADC Channels: YES

The presence of Analog to Digital Convertor channels allows for easy interfacing with analog sensors and signals, expanding the microcontroller's range of applications.

Maximum Clock Frequency: 80 MHz

The high clock frequency of 80 MHz enables fast processing speeds, making the microcontroller suitable for applications that require quick response times.

RAM Bytes: 131072

With a large RAM size of 131072 bytes, this microcontroller can handle extensive data processing and storage requirements, enhancing its capability for complex tasks.

Connectivity: CAN(2), SCI, SPI(3)

Multiple connectivity options such as CAN, SCI, and SPI interfaces provide versatility for communication with other devices or systems, making it a versatile choice for various applications.

Technical Specifications

Microcontrollers XRM44L920PZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

45

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(2), SCI, SPI(3)

Peripherals:

DMA(16), POR, PWM(8), TIMER(22), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

XRM44L920PZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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