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XIO1100ZWS

Texas Instruments

XIO1100ZWS by Texas Instruments

XIO1100ZWS by Texas Instruments is a PCI bus controller with 100 terminals in a low-profile, fine-pitch grid array package. It operates at 125 MHz with a data transfer rate of 312.5 MBps, suitable for commercial-grade applications requiring high-speed peripheral ICs.

Median Price

$12.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 156 parts In-Stock

1+ parts

$12.320

100+ parts

$9.760

1k+ parts

$9.010

10k+ parts

$8.360

156

$12.320

$9.760

$9.010

$8.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 774 parts In-Stock

1+ parts

$11.704

100+ parts

-

1k+ parts

-

10k+ parts

-

774

$11.704

-

-

-

Vyrian

USA . 3,781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,781

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,263 parts In-Stock

1+ parts

$11.088

100+ parts

-

1k+ parts

-

10k+ parts

-

2,263

$11.088

-

-

-

Component Stockers USA

USA . 14,669 parts In-Stock

1+ parts

$11.990

100+ parts

$9.500

1k+ parts

$6.220

10k+ parts

$6.220

14,669

$11.990

$9.500

$6.220

$6.220

Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

$45.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,017

$45.746

-

-

-

Corohmni

South Africa . 4,868 parts In-Stock

1+ parts

$46.156

100+ parts

-

1k+ parts

-

10k+ parts

-

4,868

$46.156

-

-

-

DigiPath Technology Company

USA . 1,982 parts In-Stock

1+ parts

$50.372

100+ parts

-

1k+ parts

-

10k+ parts

-

1,982

$50.372

-

-

-

ChromeModa Solutions

Germany . 5,174 parts In-Stock

1+ parts

$51.400

100+ parts

$42.148

1k+ parts

-

10k+ parts

-

5,174

$51.400

$42.148

-

-

IDEA Electronic Components Group

UK . 1,216 parts In-Stock

1+ parts

$51.400

100+ parts

$48.830

1k+ parts

$46.260

10k+ parts

-

1,216

$51.400

$48.830

$46.260

-

Microchip USA

USA . 2,733 parts In-Stock

1+ parts

$110.460

100+ parts

$108.540

1k+ parts

$107.580

10k+ parts

$106.620

2,733

$110.460

$108.540

$107.580

$106.620

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Overview

Experience unparalleled performance and reliability with the XIO1100ZWS by Texas Instruments, a leading manufacturer in the industry of Bus Controllers. This cutting-edge product offers seamless integration, high-speed data transfer rates, and versatile applications in various devices. Enhance your projects with the value and benefits that this top-of-the-line technology provides, setting new standards for efficiency and innovation. Trust in Texas Instruments to deliver quality and excellence with the XIO1100ZWS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight housing for the bus controller, ensuring long-lasting performance.

Maximum Supply Voltage: 1.65 V

Allows for a stable and efficient power supply within the specified voltage range.

Maximum Data Transfer Rate: 312.5 MBps

Enables high-speed data transfer, making this bus controller suitable for demanding applications.

Maximum Clock Frequency: 125 MHz

Supports fast processing speeds, ensuring smooth operation of the bus controller.

Bus Compatibility: PCI

Compatible with the widely used PCI bus standard, making it versatile and easy to integrate into existing systems.

Technical Specifications

Bus Controllers XIO1100ZWS attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

PCI

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

312.5 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO1100ZWS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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