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XIO1100ZGBR

Texas Instruments

XIO1100ZGBR by Texas Instruments

XIO1100ZGBR by Texas Instruments is a 100-terminal bus controller with max data rate of 312.5 MBps, compatible with PCI bus technology. Operating temp range from 0 to 70 °C makes it ideal for commercial applications requiring high-speed data transfer in compact spaces. Package style is grid array, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,495 parts In-Stock

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7,495

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Digiode

USA . 3,464 parts In-Stock

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3,464

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Distributors (Availability)

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One Stop Electronics

USA . 817 parts In-Stock

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$3.000

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817

$3.000

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AZTECH Wire

Italy . 508 parts In-Stock

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$4.954

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508

$4.954

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Parana Technologies

USA . 82 parts In-Stock

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$44.496

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82

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DigiPath Technology Company

USA . 304 parts In-Stock

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$48.995

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304

$48.995

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IDEA Electronic Components Group

UK . 908 parts In-Stock

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$49.995

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$47.495

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$44.996

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908

$49.995

$47.495

$44.996

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ChromeModa Solutions

Germany . 561 parts In-Stock

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$49.995

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$40.996

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561

$49.995

$40.996

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Corohmni

South Africa . 39 parts In-Stock

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$52.755

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Corphita

USA . 796 parts In-Stock

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Microchip USA

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Overview

Unlock the power of seamless data transfer with the XIO1100ZGBR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that meet the highest standards. This bus controller is perfect for applications requiring high-speed data processing, offering a maximum data transfer rate of 312.5 MBps. With a wide range of benefits including ease of installation, reliability, and efficiency, the XIO1100ZGBR provides unmatched value for customers seeking optimal performance in their systems. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in portable or rugged environments.

Surface Mount: YES

Surface mount technology allows for easy installation and maintenance, saving time and effort during assembly.

Maximum Supply Voltage: 1.65 V

The high maximum supply voltage ensures compatibility with a wide range of systems and devices.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 100

Having a high number of terminals provides versatility in connectivity options and enables the product to support various configurations.

Package Style (Meter): GRID ARRAY

The grid array package style offers a reliable and organized layout for the terminals, facilitating better signal integrity and performance.

Minimum Supply Voltage: 1.35 V

The low minimum supply voltage helps in reducing power consumption and enhances the efficiency of the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can function reliably in diverse environmental conditions without overheating.

Maximum Data Transfer Rate: 312.5 MBps

The high data transfer rate enables fast and efficient communication between connected devices, improving overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function effectively even in cold temperature settings.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish enhances conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: BOTTOM

Having terminals positioned at the bottom helps in easy and secure connections with other components, minimizing the risk of disconnection.

Width: 12 mm

The compact width of the product allows for efficient use of space on circuit boards and facilitates seamless integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and allows for reliable connections during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures that the product can withstand the soldering process without any damage.

Length: 12 mm

The compact length of the product makes it suitable for space-constrained applications and helps in achieving a streamlined design.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades, the product is suited for standard operating conditions in commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

The peripheral IC type as a bus controller for PCI ensures compatibility with PCI-based systems, making it a versatile and widely applicable product.

Technology: CMOS

The use of CMOS technology results in low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Terminal Form: BALL

The terminal form as balls provides a reliable and secure connection, especially in applications where shock and vibration may occur.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V strikes a balance between power efficiency and performance, making it suitable for various applications.

Bus Compatibility: PCI

The compatibility with the PCI bus standard ensures seamless integration with PCI-based systems, expanding the product's usability and functionality.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product's components are designed to withstand moderate moisture exposure during storage or handling.

Technical Specifications

Bus Controllers XIO1100ZGBR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

PCI

Maximum Data Transfer Rate:

312.5 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO1100ZGBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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