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USB4624I-1080HN-TR

Microchip Technology

USB4624I-1080HN-TR by Microchip Technology

Microchip Technology's USB4624I-1080HN-TR is a BUS CONTROLLER with 48 terminals, operating at 24 MHz clock frequency. It supports I2C, SMBUS, SPI, UART, and USB buses with a data transfer rate of 60 MBps. Ideal for industrial applications requiring a compact chip carrier package with low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,024 parts In-Stock

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7,024

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 557 parts In-Stock

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$8.791

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557

$8.791

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Corohmni

South Africa . 2,357 parts In-Stock

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$19.358

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$19.358

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Ampacity Inc.

Singapore . 1,560 parts In-Stock

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$20.000

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$20.000

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Aztec Data Supply Inc.

USA . 3,016 parts In-Stock

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$81.091

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$81.091

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Lixinc

USA . 10,450 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,194 parts In-Stock

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Continental Prestige Electronics

USA . 5,498 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,912 parts In-Stock

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West Coast Incorporated

USA . 1,299 parts In-Stock

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1,299

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unlock the power of seamless data transfer with the USB4624I-1080HN-TR by Microchip Technology. As a leader in innovative technology solutions, Microchip delivers unparalleled quality and reliability. This bus controller is versatile, compatible with I2C, SMBUS, SPI, UART, and USB, making it ideal for a wide range of applications. With a maximum data transfer rate of 60 MBps and a maximum clock frequency of 24 MHz, this product offers lightning-fast performance. Trust Microchip to provide you with cutting-edge technology that enhances your devices and simplifies your processes. Elevate your connectivity with the USB4624I-1080HN-TR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, ideal for a bus controller that may be subjected to various environmental conditions.

Surface Mount: YES

Allows for easy and secure installation on a printed circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 2 V

Can safely handle a higher voltage input, providing versatility in powering options.

Screening Level: TS 16949

Compliance with TS 16949 standards ensures high quality and reliability in the manufacturing process.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB and easy alignment during installation.

No. of Terminals: 48

Sufficient number of terminals for connecting various components and peripherals in a bus system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides effective heat dissipation and compact design for optimized performance in a limited space.

Minimum Supply Voltage: 1.6 V

Allows for operation with lower voltage sources, making it energy efficient and suitable for a range of devices.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without compromising performance or reliability.

Maximum Data Transfer Rate: 60 MBps

High data transfer rate allows for fast communication between connected devices, improving overall system efficiency.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, enhancing the product's versatility in different environments.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures stable electrical connections for long-term reliability.

Terminal Position: QUAD

Quad terminal position offers a secure and stable connection with the PCB, reducing the risk of disconnection or signal interference.

Maximum Seated Height: 1 mm

Low profile design allows for easy integration into compact electronic devices, saving space and improving overall aesthetics.

Width: 7 mm

Compact width dimension enables the bus controller to fit into tight spaces on the PCB, optimizing layout and placement.

Maximum Clock Frequency: 24 MHz

High clock frequency supports fast data processing and communication between devices, enhancing system performance.

Length: 7 mm

Compact length dimension facilitates easy installation and placement on the PCB, particularly in space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making it suitable for a wide range of applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Versatile bus controller that supports various bus interfaces, including USB, for seamless connectivity with different devices.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, contributing to energy efficiency and performance.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and provides reliable electrical connections for long-term use.

Maximum Supply Current: 80 mA

Low supply current requirement helps minimize power consumption and heat generation, enhancing overall efficiency.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the bus controller under varying load conditions.

Bus Compatibility: I2C; SMBUS; SPI; UART; USB

Support for multiple bus interfaces allows for easy integration with a variety of devices and systems, increasing flexibility and compatibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, maximizing connectivity options and saving valuable space.

Technical Specifications

Bus Controllers USB4624I-1080HN-TR attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Bus Compatibility:

I2C; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

24 MHz

Maximum Data Transfer Rate:

60 MBps

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.6 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

USB4624I-1080HN-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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