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XAM437XAZDN100

Texas Instruments

XAM437XAZDN100 by Texas Instruments

XAM437XAZDN100 by Texas Instruments is a 32-bit RISC microprocessor with integrated cache and 16-bit address bus. It operates at a max clock frequency of 26 MHz, suitable for low power applications in various industries like automotive and industrial automation.

Median Price

$12.230

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

1+ parts

$12.230

100+ parts

$11.990

1k+ parts

$11.740

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5

$12.230

$11.990

$11.740

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,516 parts In-Stock

1+ parts

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4,516

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Vyrian

USA . 2,484 parts In-Stock

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2,484

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Distributors (Availability)

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One Stop Electronics

USA . 878 parts In-Stock

1+ parts

$18.000

100+ parts

-

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878

$18.000

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AZTECH Wire

Italy . 335 parts In-Stock

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$19.249

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335

$19.249

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Parana Technologies

USA . 399 parts In-Stock

1+ parts

$24.107

100+ parts

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$24.759

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399

$24.107

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$24.759

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DigiPath Technology Company

USA . 1,211 parts In-Stock

1+ parts

$26.545

100+ parts

$24.422

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1,211

$26.545

$24.422

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IDEA Electronic Components Group

UK . 2,334 parts In-Stock

1+ parts

$27.087

100+ parts

$25.733

1k+ parts

$24.378

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2,334

$27.087

$25.733

$24.378

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ChromeModa Solutions

Germany . 1,179 parts In-Stock

1+ parts

$27.087

100+ parts

$22.211

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1,179

$27.087

$22.211

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Ampacity Inc.

Singapore . 1,284 parts In-Stock

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$32.000

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1,284

$32.000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,932 parts In-Stock

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1,932

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Microchip USA

USA . 109 parts In-Stock

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109

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Overview

Unlock the power of cutting-edge technology with the XAM437XAZDN100 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers top-quality products that exceed industry standards. The XAM437XAZDN100 is a versatile microprocessor with integrated cache and a high clock frequency, making it ideal for a wide range of applications. From IoT devices to industrial automation, this microprocessor offers customers unmatched performance and reliability. Experience the difference with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the microprocessor easy to handle and long-lasting.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing data access times and increasing overall speed.

Maximum Supply Voltage: 1.144 V

This allows for efficient power consumption while still providing enough voltage for optimal performance.

Address Bus Width: 16

A wider address bus allows for more efficient memory addressing and access, leading to faster data retrieval and processing.

Package Shape: SQUARE

Square packages are compact and take up less space on a circuit board, making them ideal for devices with limited space.

Bit Size: 32

A 32-bit architecture allows for processing larger chunks of data at once, improving overall speed and efficiency.

No. of Terminals: 491

Having a high number of terminals allows for more connectivity options and flexibility in integrating the microprocessor into different systems.

Package Style (Meter): GRID ARRAY

A grid array package style provides excellent thermal performance and electrical connectivity, ensuring the reliability and stability of the microprocessor.

Minimum Supply Voltage: 1.056 V

This low minimum supply voltage allows for energy-efficient operation while still maintaining the required performance levels.

Terminal Position: BOTTOM

Bottom terminal positioning makes it easier to mount and connect the microprocessor on a circuit board, simplifying the assembly process.

Boundary Scan: YES

Having boundary scan capability allows for testing and debugging of the microprocessor, ensuring high quality and reliability in the final product.

External Data Bus Width: 32

A wide external data bus enables faster data transfer between the microprocessor and other components, improving overall performance.

Maximum Clock Frequency: 26 MHz

With a high maximum clock frequency, the microprocessor can handle complex tasks and process data at a faster rate, making it suitable for demanding applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers simplified instructions and efficient processing, making the microprocessor well-suited for high-speed and low-power applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term use.

Terminal Form: BALL

Ball terminal form simplifies the soldering and connection process, ensuring secure and reliable connections for the microprocessor.

Nominal Supply Voltage: 1.1 V

A stable nominal supply voltage ensures consistent performance and reliability of the microprocessor under varying operational conditions.

Format: FLOATING POINT

Floating-point format allows for precise mathematical calculations and complex computations, making the microprocessor suitable for scientific and graphics-intensive applications.

Speed: 1000 rpm

With a speed of 1000 rpm, the microprocessor can quickly process data and execute commands, making it suitable for high-performance computing tasks.

Low Power Mode: YES

Having a low power mode allows the microprocessor to conserve energy when not in use, extending battery life and reducing overall power consumption.

Technical Specifications

Microprocessors XAM437XAZDN100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

Low Power Mode:

YES

No. of Terminals:

491

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Speed:

1000 rpm

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

XAM437XAZDN100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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