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V62/06638-01XE

Texas Instruments

V62/06638-01XE by Texas Instruments

V62/06638-01XE by Texas Instruments is a 10-bit D/A converter with 1.25V max analog output voltage, 0.0977% linearity error, and 3.3V power supply. Ideal for military applications due to its MIL temperature grade, it features a fast settling time of 0.02us and operates in a wide temperature range from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,401 parts In-Stock

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7,401

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Digiode

USA . 1,918 parts In-Stock

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1,918

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,078 parts In-Stock

1+ parts

$4.000

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1,078

$4.000

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Parana Technologies

USA . 1,968 parts In-Stock

1+ parts

$5.991

100+ parts

-

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$6.766

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1,968

$5.991

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$6.766

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DigiPath Technology Company

USA . 1,270 parts In-Stock

1+ parts

$6.596

100+ parts

$6.069

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1,270

$6.596

$6.069

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ChromeModa Solutions

Germany . 6,965 parts In-Stock

1+ parts

$6.731

100+ parts

$5.519

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6,965

$6.731

$5.519

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IDEA Electronic Components Group

UK . 1,575 parts In-Stock

1+ parts

$6.731

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$6.058

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1,575

$6.731

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$6.058

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AZTECH Wire

Italy . 817 parts In-Stock

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$15.815

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817

$15.815

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Corphita

USA . 2,312 parts In-Stock

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Overview

Discover the unparalleled precision and reliability of the V62/06638-01XE by Texas Instruments, a top-of-the-line Digital-to-Analog Converter designed to exceed your expectations. With a MILITARY-grade temperature grade and a sample rate of 275 MHz, this innovative product offers unmatched performance in a compact package. Whether you're looking to enhance your audio systems or improve signal processing, the V62/06638-01XE delivers exceptional value and quality. Trust Texas Instruments for cutting-edge technology that brings your projects to new heights.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

The high maximum analog output voltage allows for a wide range of output signals, making this product versatile for various applications.

No. of Bits: 10

With 10 bits, this digital-to-analog converter provides precise and accurate conversion of digital signals to analog, ensuring high-quality output.

Sample Rate: 275 MHz

The high sample rate of 275 MHz ensures that the converter can quickly and efficiently process digital signals, making it suitable for high-speed applications.

Technology: CMOS

The CMOS technology used in this converter enables low power consumption and high noise immunity, making it an efficient and reliable choice for various electronic devices.

Temperature Grade: MILITARY

The military-grade temperature range of -55°C to 125°C ensures that this converter can operate reliably in harsh environmental conditions, making it suitable for military and aerospace applications.

Technical Specifications

Digital-to-Analog Converters V62/06638-01XE attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

20 ns

Maximum Supply Current:

90 mA

Sample Rate:

275 MHz

No. of Bits:

10

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-.8 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Trade Compliance

V62/06638-01XE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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