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V62/06602-01XE

Texas Instruments

V62/06602-01XE by Texas Instruments

V62/06602-01XE by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.1V and settling time of 3us. Ideal for military applications, it operates in temperatures ranging from -55 to 125°C and has a sample rate of 0.102MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,244 parts In-Stock

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5,244

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Digiode

USA . 952 parts In-Stock

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952

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 12 parts In-Stock

1+ parts

$5.146

100+ parts

-

1k+ parts

$5.742

10k+ parts

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12

$5.146

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$5.742

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DigiPath Technology Company

USA . 744 parts In-Stock

1+ parts

$5.666

100+ parts

$5.213

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744

$5.666

$5.213

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ChromeModa Solutions

Germany . 4,795 parts In-Stock

1+ parts

$5.782

100+ parts

$4.741

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4,795

$5.782

$4.741

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IDEA Electronic Components Group

UK . 2,178 parts In-Stock

1+ parts

$5.782

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$5.204

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2,178

$5.782

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$5.204

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AZTECH Wire

Italy . 226 parts In-Stock

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$16.832

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226

$16.832

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One Stop Electronics

USA . 604 parts In-Stock

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$20.000

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604

$20.000

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Corphita

USA . 4,207 parts In-Stock

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Overview

Discover the power of precision with the V62/06602-01XE by Texas Instruments, a high-quality digital-to-analog converter designed to elevate your electronics projects to new heights. Manufactured by the industry leader in semiconductor technology, this compact device offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile converter delivers smooth analog output voltage up to 5.1V, making it perfect for military-grade projects and beyond. Experience the value and benefits of cutting-edge technology with the V62/06602-01XE - unlock a world of possibilities for your next innovation.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

Ensures high quality and accurate analog output signal.

No. of Bits: 12

Provides a high resolution for precise conversion of digital signals to analog.

Maximum Linearity Error (EL): 0.0977%

Ensures accurate linearity in the conversion process.

Maximum Settling Time: 3 us

Allows for quick settling of the output signal, reducing distortion.

Technology: CMOS

Utilizes CMOS technology for efficient and low power consumption.

Input Format: SERIAL

Accepts input in serial format, which is convenient for many applications.

Technical Specifications

Digital-to-Analog Converters V62/06602-01XE attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

5.6 mA

Maximum Settling Time:

3 µs

Sample Rate:

102 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

V62/06602-01XE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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