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V62/06671-02XE

Texas Instruments

V62/06671-02XE by Texas Instruments

V62/06671-02XE by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 5.5V and settling time of 1us. Ideal for military applications, it operates in temperatures ranging from -55 to 125°C, featuring a small outline package style and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,582 parts In-Stock

1+ parts

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3,582

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Vyrian

USA . 2,385 parts In-Stock

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2,385

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,867 parts In-Stock

1+ parts

$5.520

100+ parts

-

1k+ parts

$6.273

10k+ parts

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1,867

$5.520

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$6.273

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DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

$6.078

100+ parts

$5.592

1k+ parts

-

10k+ parts

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1,689

$6.078

$5.592

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ChromeModa Solutions

Germany . 3,741 parts In-Stock

1+ parts

$6.202

100+ parts

$5.086

1k+ parts

-

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3,741

$6.202

$5.086

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IDEA Electronic Components Group

UK . 1,026 parts In-Stock

1+ parts

$6.202

100+ parts

-

1k+ parts

$5.582

10k+ parts

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1,026

$6.202

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$5.582

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AZTECH Wire

Italy . 434 parts In-Stock

1+ parts

$8.250

100+ parts

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434

$8.250

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One Stop Electronics

USA . 845 parts In-Stock

1+ parts

$21.000

100+ parts

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845

$21.000

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Corphita

USA . 2,095 parts In-Stock

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2,095

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Overview

Experience unparalleled precision and reliability with the V62/06671-02XE by Texas Instruments. As a leader in the industry, Texas Instruments has crafted this advanced Digital-to-Analog Converter to deliver top-notch performance in military-grade applications. With a lightning-fast settling time of just 1 us and an incredibly low linearity error of 0.0023%, this converter ensures seamless operation and accurate outputs every time. Trust Texas Instruments to provide you with the quality and innovation you need for your most demanding projects. Choose the V62/06671-02XE and elevate your designs to new heights.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

High maximum analog output voltage allows for a wide dynamic range and accurate signal reproduction.

No. of Bits: 16

High number of bits results in finer resolution and better precision in converting digital signals to analog.

Maximum Settling Time: 1 us

Fast settling time ensures quick and accurate conversion of digital data to analog output.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliability and performance in harsh environments.

Sample Rate: 1 MHz

High sample rate allows for fast and accurate conversion of digital signals to analog output.

Technical Specifications

Digital-to-Analog Converters V62/06671-02XE attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0023 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

20 μA

Maximum Settling Time:

1 µs

Sample Rate:

1 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

V62/06671-02XE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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