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V62/04646-01XE

Texas Instruments

V62/04646-01XE by Texas Instruments

V62/04646-01XE by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.1V and settling time of 10us. Ideal for military applications, it operates in temperature range -55 to 125 °C and has a sample rate of 0.093 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,196 parts In-Stock

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3,196

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Digiode

USA . 2,271 parts In-Stock

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2,271

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Component Sense

UK . 384 parts In-Stock

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384

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Distributors (Availability)

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AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$8.563

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596

$8.563

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Parana Technologies

USA . 496 parts In-Stock

1+ parts

$16.403

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$16.698

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496

$16.403

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$16.698

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DigiPath Technology Company

USA . 47 parts In-Stock

1+ parts

$18.061

100+ parts

$16.616

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47

$18.061

$16.616

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ChromeModa Solutions

Germany . 410 parts In-Stock

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$18.430

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$15.113

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410

$18.430

$15.113

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IDEA Electronic Components Group

UK . 52 parts In-Stock

1+ parts

$18.430

100+ parts

$17.508

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$16.587

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52

$18.430

$17.508

$16.587

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One Stop Electronics

USA . 752 parts In-Stock

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$19.000

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752

$19.000

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Component Stockers USA

USA . 765 parts In-Stock

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$99.990

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765

$99.990

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Corphita

USA . 673 parts In-Stock

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Overview

Experience the exceptional quality and precision of Texas Instruments with the V62/04646-01XE Digital-to-Analog Converter. This cutting-edge technology offers unparalleled performance and reliability in a wide range of applications. From industrial automation to military-grade equipment, this converter provides a seamless transition from digital signals to analog output with minimal settling time and maximum linearity error. Trust in Texas Instruments to deliver value and innovation with every product, setting new standards for excellence in the industry. Elevate your designs and projects with the V62/04646-01XE, where quality meets performance.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

Provides a high maximum output voltage, allowing for a wide range of analog signals to be accurately converted.

No. of Bits: 12

Higher number of bits allows for a finer resolution and more accurate conversion of digital signals to analog.

Maximum Linearity Error (EL): 0.0977%

Provides high linearity, ensuring that the output accurately corresponds to the input signal.

Power Supplies (V): 3/5

Supports multiple power supply options, making it versatile and compatible with various systems.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, suitable for demanding industrial and military applications.

Technical Specifications

Digital-to-Analog Converters V62/04646-01XE attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

2.3 mA

Maximum Settling Time:

10 µs

Sample Rate:

93 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

V62/04646-01XE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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