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V62/05619-01XE

Texas Instruments

V62/05619-01XE by Texas Instruments

V62/05619-01XE by Texas Instruments is a 14-bit D/A converter with max output voltage of 3.9V and linearity error of 0.0281%. Ideal for military applications, it operates b/w -55 to 125 °C with a sample rate of 400 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,487 parts In-Stock

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6,487

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Digiode

USA . 540 parts In-Stock

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540

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$9.607

100+ parts

-

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888

$9.607

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Parana Technologies

USA . 1,031 parts In-Stock

1+ parts

$11.933

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$12.338

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1,031

$11.933

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$12.338

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DigiPath Technology Company

USA . 2,105 parts In-Stock

1+ parts

$13.140

100+ parts

$12.089

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2,105

$13.140

$12.089

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ChromeModa Solutions

Germany . 5,854 parts In-Stock

1+ parts

$13.408

100+ parts

$10.995

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5,854

$13.408

$10.995

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IDEA Electronic Components Group

UK . 1,598 parts In-Stock

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$13.408

100+ parts

$12.738

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$12.067

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1,598

$13.408

$12.738

$12.067

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One Stop Electronics

USA . 896 parts In-Stock

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$31.000

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896

$31.000

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Corphita

USA . 3,409 parts In-Stock

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3,409

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Overview

Elevate your digital-to-analog conversion experience with the V62/05619-01XE by Texas Instruments. Crafted with precision and expertise, this converter offers unparalleled quality and reliability. Ideal for military-grade applications, this product ensures optimal performance even in extreme conditions. With a fast nominal settling time and high sample rate of 400 MHz, this converter delivers seamless and accurate analog output voltage. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Upgrade to the V62/05619-01XE for superior results every time.

Feature Benefit Bullets

Maximum Analog Output Voltage: 3.9 V

Provides a high maximum analog output voltage, allowing for a wide range of output signal levels.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the converter.

No. of Bits: 14

A higher number of bits (14 in this case) allows for higher resolution and accuracy in the conversion process.

Nominal Settling Time (tstl): 0.012 us

The fast nominal settling time ensures that the output signal reaches its final value quickly, minimizing delays in the conversion process.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperature environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter efficient and reliable.

Sample Rate: 400 MHz

A high sample rate of 400 MHz allows for fast and accurate conversion of digital signals to analog output.

Technical Specifications

Digital-to-Analog Converters V62/05619-01XE attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0281 %

Nominal Settling Time (tstl):

12 ns

Sample Rate:

400 MHz

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

2.15 V

Maximum Analog Output Voltage:

3.9 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Trade Compliance

V62/05619-01XE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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