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UCD7230RGWTG4

Texas Instruments

UCD7230RGWTG4 by Texas Instruments

UCD7230RGWTG4 by Texas Instruments is a MOSFET gate driver with 20 terminals, operating voltage of 4.5-15.5V, and peak current limit of 4A. It is used in industrial applications requiring high temperature tolerance up to 105°C, suitable for surface mount assembly with a compact square package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,490 parts In-Stock

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4,490

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Vyrian

USA . 4,217 parts In-Stock

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4,217

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Semi Source

USA . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,884 parts In-Stock

1+ parts

$6.388

100+ parts

-

1k+ parts

$7.137

10k+ parts

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1,884

$6.388

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$7.137

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AZTECH Wire

Italy . 332 parts In-Stock

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$6.763

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332

$6.763

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IDEA Electronic Components Group

UK . 1,320 parts In-Stock

1+ parts

$7.177

100+ parts

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$6.459

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1,320

$7.177

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$6.459

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ChromeModa Solutions

Germany . 285 parts In-Stock

1+ parts

$7.177

100+ parts

$5.885

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285

$7.177

$5.885

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One Stop Electronics

USA . 1,296 parts In-Stock

1+ parts

$17.500

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1,296

$17.500

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Microchip USA

USA . 4,601 parts In-Stock

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4,601

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Corphita

USA . 4,227 parts In-Stock

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4,227

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DigiPath Technology Company

USA . 86 parts In-Stock

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$6.471

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86

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$6.471

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Overview

Enhance the performance and efficiency of your electronic designs with the Texas Instruments UCD7230RGWTG4 MOSFET Gate Driver. Crafted with precision by a renowned manufacturer, this compact chip carrier offers unparalleled reliability and quality. Ideal for a wide range of applications, this gate driver ensures seamless operation and precise control, making it a valuable asset to any project. Say goodbye to inefficiencies and welcome top-notch performance with the UCD7230RGWTG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making this product suitable for applications where weight and size are critical.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 15.5 V

High maximum supply voltage ensures compatibility with a wide range of power supply options, giving flexibility in system design.

Package Shape: SQUARE

Square package shape optimizes space utilization on the PCB, making it suitable for compact electronic devices.

Power Supplies (V): 12

Stable power supply at 12V ensures reliable and consistent performance of the gate driver in various operating conditions.

No. of Terminals: 20

Ample number of terminals allow for versatile connectivity options, enabling easy integration into different circuit configurations.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier with a very thin profile reduces space requirements on the PCB, making it suitable for compact designs.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures efficient operation even in low-power scenarios, improving energy efficiency.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows the gate driver to withstand elevated temperatures, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40 to 105°C enables the gate driver to function in extreme temperature conditions, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure soldering onto the PCB, improving the overall robustness of the connections.

Maximum Seated Height: 1 mm

Low seated height minimizes the overall profile of the gate driver on the PCB, making it suitable for applications with height restrictions.

Width: 5 mm

Compact width of 5mm enables the gate driver to be easily accommodated in tight spaces, enhancing its versatility in various electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature of 260°C ensures proper soldering of the gate driver onto the PCB, reducing the risk of joint failure.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for reliable soldering of the gate driver, ensuring durable connections in the assembly process.

Length: 5 mm

Compact length of 5mm contributes to the overall small footprint of the gate driver on the PCB, enabling space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the gate driver can operate reliably in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and industry standards, making the gate driver environmentally friendly.

Maximum Supply Current: 8 mA

Low maximum supply current of 8mA reduces power consumption, contributing to energy efficiency and prolonging battery life in portable devices.

Nominal Supply Voltage: 12 V

Stable nominal supply voltage of 12V ensures consistent and reliable operation of the gate driver in various operating conditions.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for compact terminal arrangement on the gate driver, saving space on the PCB and enabling high-density designs.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates that the gate driver is capable of withstanding moderate levels of moisture exposure during storage and handling.

Nominal Output Peak Current Limit: 4 A

High nominal output peak current limit of 4A enables the gate driver to drive high-power MOSFETs effectively, supporting robust and efficient circuit operation.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Buffer or inverter based MOSFET driver interface IC type ensures compatibility with a wide range of MOSFETs, offering flexibility in circuit design.

Technical Specifications

MOSFET Gate Drivers UCD7230RGWTG4 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

UCD7230RGWTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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