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UCC5390ECDR

Texas Instruments

UCC5390ECDR by Texas Instruments

UCC5390ECDR by Texas Instruments is a MOSFET gate driver with a max supply voltage of 33V and built-in transient and under voltage protections. With an output current of 17A, it is ideal for automotive applications requiring fast turn-on/off times (0.1us) and operates in temperatures ranging from -40 to 125°C.

Median Price

$1.990

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 58,244 parts In-Stock

1+ parts

$1.990

100+ parts

$1.743

1k+ parts

$0.985

10k+ parts

-

58,244

$1.990

$1.743

$0.985

-

Mouser Electronics

USA . 2,003 parts In-Stock

1+ parts

$2.740

100+ parts

$1.690

1k+ parts

$1.490

10k+ parts

$1.410

2,003

$2.740

$1.690

$1.490

$1.410

DigiKey

USA . 3,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.669

3,995

-

-

-

$1.669

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 28,155 parts In-Stock

1+ parts

$1.151

100+ parts

-

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-

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-

28,155

$1.151

-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.514

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-

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150

$1.514

-

-

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Digiode

USA . 2,941 parts In-Stock

1+ parts

$1.890

100+ parts

-

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-

10k+ parts

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2,941

$1.890

-

-

-

NAC Semi

USA . 22,516 parts In-Stock

1+ parts

-

100+ parts

$3.230

1k+ parts

-

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-

22,516

-

$3.230

-

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Vyrian

USA . 22,477 parts In-Stock

1+ parts

-

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22,477

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Demsay Elektronik

Türkiye . 16,424 parts In-Stock

1+ parts

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16,424

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,700 parts In-Stock

1+ parts

$1.514

100+ parts

-

1k+ parts

-

10k+ parts

$1.484

6,700

$1.514

-

-

$1.484

Argo Parts USA

USA . 4,684 parts In-Stock

1+ parts

$1.514

100+ parts

-

1k+ parts

-

10k+ parts

-

4,684

$1.514

-

-

-

Semicontronic

India . 22,731 parts In-Stock

1+ parts

$1.690

100+ parts

$1.648

1k+ parts

$1.639

10k+ parts

-

22,731

$1.690

$1.648

$1.639

-

Ampacity Inc.

Singapore . 22,712 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

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-

22,712

$1.690

-

-

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Corphita

USA . 1,003 parts In-Stock

1+ parts

$1.791

100+ parts

-

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1,003

$1.791

-

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Corohmni

South Africa . 810 parts In-Stock

1+ parts

$5.929

100+ parts

-

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810

$5.929

-

-

-

Parana Technologies

USA . 2,054 parts In-Stock

1+ parts

$7.731

100+ parts

-

1k+ parts

$8.267

10k+ parts

-

2,054

$7.731

-

$8.267

-

DigiPath Technology Company

USA . 681 parts In-Stock

1+ parts

$8.513

100+ parts

$7.832

1k+ parts

-

10k+ parts

-

681

$8.513

$7.832

-

-

ChromeModa Solutions

Germany . 4,781 parts In-Stock

1+ parts

$8.687

100+ parts

$7.123

1k+ parts

-

10k+ parts

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4,781

$8.687

$7.123

-

-

IDEA Electronic Components Group

UK . 731 parts In-Stock

1+ parts

$8.687

100+ parts

$8.253

1k+ parts

$7.818

10k+ parts

-

731

$8.687

$8.253

$7.818

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$10.645

100+ parts

$10.113

1k+ parts

$10.113

10k+ parts

-

100

$10.645

$10.113

$10.113

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GreenTree Electronics

Israel . 17,498 parts In-Stock

1+ parts

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17,498

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Lixinc

USA . 12,378 parts In-Stock

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12,378

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.484

1k+ parts

$1.438

10k+ parts

$1.408

100

-

$1.484

$1.438

$1.408

Overview

Enhance the performance of your MOSFET applications with the Texas Instruments UCC5390ECDR. Manufactured with the highest quality standards, this MOSFET gate driver offers built-in protections, reliable operation, and a wide range of supply voltages for flexibility. Whether you're in the automotive industry or working on industrial projects, this compact and efficient driver will provide you with the value and reliability you need to succeed. Upgrade your designs today with the UCC5390ECDR and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the gate driver, ensuring its longevity and reliability.

Surface Mount: YES

Being surface-mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 15 V

With a maximum supply voltage of 15V, this gate driver can handle higher voltage applications, providing versatility in usage.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing PCB designs, making it convenient for various applications.

Built-in Protections: TRANSIENT; UNDER VOLTAGE

The built-in protections for transient voltage spikes and under-voltage conditions enhance the reliability and safety of the connected MOSFETs, ensuring optimal performance.

Maximum Supply Voltage-1: 33 V

With a maximum supply voltage of 33V, this gate driver can withstand higher voltage spikes, providing additional protection to the circuit.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, enabling the gate driver to interface with various MOSFET configurations and control signals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for applications with limited board real estate.

Minimum Supply Voltage-1: 13.2 V

With a minimum supply voltage of 13.2V, this gate driver can operate effectively even in low voltage conditions, ensuring consistent performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V allows for compatibility with a wide range of power sources, making it versatile for different applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the gate driver can withstand elevated temperatures, making it suitable for industrial and automotive environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the gate driver to function reliably in cold environments, enhancing its usability in various conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections for optimal performance.

Terminal Position: DUAL

Having dual terminal positions enables increased flexibility in installation and wiring, accommodating different PCB layouts.

Maximum Seated Height: 2.8 mm

The low maximum seated height of 2.8mm helps in reducing the overall profile of the circuit, making it suitable for compact electronic designs.

Width: 5.85 mm

The narrow width of 5.85mm allows for efficient space utilization on the PCB, enabling tight layout designs for compact devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during the manufacturing process, contributing to the overall quality and durability of the gate driver.

Length: 7.5 mm

The compact length of 7.5mm helps in minimizing the footprint of the gate driver on the PCB, enabling efficient use of board space.

Temperature Grade: AUTOMOTIVE

Being classified as automotive-grade indicates that the gate driver is designed to meet the stringent requirements and reliability standards for automotive applications, ensuring robust performance in harsh environments.

Maximum Output Current: 17 A

With a maximum output current of 17A, this gate driver can drive high-current loads, making it suitable for power electronic applications that require high current switching.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and mounting on the PCB, enhancing the reliability of electrical connections and simplifying assembly processes.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures compatibility with standard power sources, making the gate driver suitable for a wide range of applications.

Turn-on Time: 0.1 us

The fast turn-on time of 0.1 microseconds ensures quick response and precise control of the connected MOSFETs, enabling efficient switching operations.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for dense packing of terminals on the PCB, enabling high-density integration and compact circuit designs.

Nominal Supply Voltage-1: 15 V

With a nominal supply voltage of 15V, the gate driver operates efficiently within standard voltage levels, ensuring compatibility with common power sources.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that the gate driver is suitable for reflow soldering processes, ensuring reliability and preventing damage from moisture exposure.

Interface IC Type: BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

The interface IC type of buffer or inverter-based IGBT/MOSFET driver ensures seamless communication and compatibility with various types of power semiconductor devices, enhancing the gate driver's versatility in controlling different loads.

Turn-off Time: 0.1 us

The fast turn-off time of 0.1 microseconds facilitates rapid switching and precise control of the MOSFETs, reducing switching losses and improving overall efficiency.

Output Current Flow Direction: SOURCE AND SINK

Supporting source and sink output current flow direction allows the gate driver to drive both high-side and low-side MOSFETs efficiently, enabling bidirectional current control in power electronic circuits.

Technical Specifications

MOSFET Gate Drivers UCC5390ECDR attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; UNDER VOLTAGE

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

7.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Maximum Output Current:

17 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.8 mm

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

33 V

Minimum Supply Voltage-1:

13.2 V

Nominal Supply Voltage-1:

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

5.85 mm

Trade Compliance

UCC5390ECDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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