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UCC2919DTRG4

Texas Instruments

UCC2919DTRG4 by Texas Instruments

UCC2919DTRG4 by Texas Instruments is a Power Management IC with 16 terminals, operating voltage of 3-8V, and BICMOS technology. It has an adjustable threshold, operates in industrial temperature range (-40 to 85°C), and supports power supply circuits. Ideal for applications requiring precise power management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,242 parts In-Stock

1+ parts

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Digiode

USA . 4,918 parts In-Stock

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4,918

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Carlin Systems, Inc.

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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One Stop Electronics

USA . 140 parts In-Stock

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$1.500

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140

$1.500

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Parana Technologies

USA . 1,455 parts In-Stock

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$5.862

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$6.645

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1,455

$5.862

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$6.645

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IDEA Electronic Components Group

UK . 2,094 parts In-Stock

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$6.587

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$5.928

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2,094

$6.587

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$5.928

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ChromeModa Solutions

Germany . 827 parts In-Stock

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$6.587

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$5.401

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827

$6.587

$5.401

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AZTECH Wire

Italy . 591 parts In-Stock

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$8.944

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591

$8.944

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Component Stockers USA

USA . 283 parts In-Stock

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$99.990

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$99.990

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Microchip USA

USA . 5,699 parts In-Stock

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5,699

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Corphita

USA . 4,514 parts In-Stock

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4,514

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DigiPath Technology Company

USA . 1,162 parts In-Stock

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$5.939

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$5.939

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Overview

Enhance the performance of your power management systems with the UCC2919DTRG4 from Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The UCC2919DTRG4 is perfect for a wide range of applications in the power management IC category, offering customers unparalleled value and benefits. Experience seamless operation and efficiency with this cutting-edge power supply support circuit that guarantees optimal performance in industrial-grade environments. Trust Texas Instruments to deliver excellence with the UCC2919DTRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic provides good insulation and protection for the internal components, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage of 5V makes this product compatible with a wide range of applications and systems.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures ensures that the product can withstand demanding environmental conditions without malfunctioning.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization and fine-tuning of the power management settings to suit specific requirements.

Technical Specifications

Power Management ICs UCC2919DTRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1.5 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

UCC2919DTRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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