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TWL6032A2B0YFFR

Texas Instruments

TWL6032A2B0YFFR by Texas Instruments

TWL6032A2B0YFFR by Texas Instruments is a Power Management IC with 155 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, providing output voltage range of 0.6V to 3.3V at max current of 5A. Ideal for industrial power supply support circuits with 17 channels and very thin profile design.

Median Price

$8.810

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,500 parts In-Stock

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$8.810

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29,500

$8.810

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Digiode

USA . 1,981 parts In-Stock

1+ parts

$8.370

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1,981

$8.370

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Vyrian

USA . 7,269 parts In-Stock

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7,269

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Cyclops Electronics Ltd

UK . 786 parts In-Stock

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786

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Distributors (Availability)

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Corphita

USA . 1,398 parts In-Stock

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$7.929

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1,398

$7.929

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Parana Technologies

USA . 566 parts In-Stock

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$9.754

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$10.331

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566

$9.754

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$10.331

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DigiPath Technology Company

USA . 1,637 parts In-Stock

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$10.741

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1,637

$10.741

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ChromeModa Solutions

Germany . 1,711 parts In-Stock

1+ parts

$10.960

100+ parts

$8.987

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$8.987

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IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$10.960

100+ parts

$10.412

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$9.864

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449

$10.960

$10.412

$9.864

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AZTECH Wire

Italy . 436 parts In-Stock

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$15.680

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436

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Lixinc

USA . 12,518 parts In-Stock

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12,518

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A-Z Elektronik GmbH

Germany . 6,956 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Perfect Parts

USA . 2,619 parts In-Stock

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2,619

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Authorized Procurement Solutions

USA . 800 parts In-Stock

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800

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Overview

Upgrade your power management capabilities with the TWL6032A2B0YFFR by Texas Instruments. Crafted with precision and expertise by a renowned manufacturer, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless power supply support for various devices. Say goodbye to power-related issues and unlock the full potential of your electronics with this innovative solution. Trust Texas Instruments to deliver top-notch performance and efficiency for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes it easy to integrate this power management IC into compact circuit designs.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on a circuit board.

No. of Terminals: 155

With 155 terminals, this power management IC offers a high level of connectivity for various components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a very thin profile and fine pitch enables high-density mounting and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can withstand demanding industrial environments.

Minimum Output Voltage: 0.6 V

Low minimum output voltage of 0.6V allows for powering a wide range of components efficiently.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40°C, this power management IC is suitable for harsh environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/silver/copper terminal finish provides excellent conductivity and corrosion resistance for reliable performance.

Maximum Output Voltage: 3.3 V

A maximum output voltage of 3.3V ensures compatibility with a wide range of electronic devices.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and enhances thermal management.

Maximum Seated Height: 0.625 mm

With a maximum seated height of 0.625mm, this power management IC contributes to a compact overall design.

Width (mm): 5.214 mm

Narrow width of 5.214mm allows for efficient use of space on a circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC serves as a reliable power supply support circuit, enhancing the performance of electronic systems.

Minimum Supply Voltage (Vsup): 2.5 V

With a minimum supply voltage of 2.5V, this IC can operate efficiently with a range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for efficient soldering and assembly processes.

Length: 5.364 mm

Compact length of 5.364mm contributes to a space-saving design on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Maximum Output Current: 5 A

High maximum output current of 5A enables the power management IC to drive various components effectively.

No. of Channels: 17

With 17 channels, this IC can manage multiple power inputs and outputs simultaneously, offering flexibility in system design.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for stable electrical performance.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm allows for high-density mounting and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 4.8 V

With a maximum supply voltage of 4.8V, this IC can support a wide range of input power sources.

No. of Outputs: 14

Having 14 outputs enables this power management IC to distribute power efficiently to multiple components in a system.

Technical Specifications

Power Management ICs TWL6032A2B0YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

17

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TWL6032A2B0YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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