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TWL6032A1B4YFFT

Texas Instruments

TWL6032A1B4YFFT by Texas Instruments

TWL6032A1B4YFFT by Texas Instruments is a Power Management IC with 155 terminals, supporting 17 channels and 14 outputs. It operates in industrial temperature range (-40 to 85°C) with output voltage ranging from 0.6V to 3.3V, making it ideal for power supply support circuits in various applications.

Median Price

$9.815

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,950 parts In-Stock

1+ parts

$10.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,950

$10.340

-

-

-

Rochester

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$9.290

1k+ parts

$8.310

10k+ parts

$7.820

1,250

-

$9.290

$8.310

$7.820

DigiKey

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$8.110

1k+ parts

-

10k+ parts

-

1,250

-

$8.110

-

-

Verical

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$11.613

1k+ parts

$10.387

10k+ parts

$9.775

1,250

-

$11.613

$10.387

$9.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 526 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

-

10k+ parts

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526

$7.581

-

-

-

Vyrian

USA . 3,106 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

-

10k+ parts

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3,106

$7.980

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 995 parts In-Stock

1+ parts

$6.780

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$6.780

-

-

-

Semicontronic

India . 989 parts In-Stock

1+ parts

$6.780

100+ parts

$6.610

1k+ parts

$6.577

10k+ parts

-

989

$6.780

$6.610

$6.577

-

Corphita

USA . 3,991 parts In-Stock

1+ parts

$7.182

100+ parts

-

1k+ parts

-

10k+ parts

-

3,991

$7.182

-

-

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Corohmni

South Africa . 371 parts In-Stock

1+ parts

$7.980

100+ parts

-

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-

10k+ parts

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371

$7.980

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-

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Parana Technologies

USA . 2,054 parts In-Stock

1+ parts

$10.287

100+ parts

-

1k+ parts

$10.816

10k+ parts

-

2,054

$10.287

-

$10.816

-

DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

$11.327

100+ parts

$10.421

1k+ parts

-

10k+ parts

-

2,004

$11.327

$10.421

-

-

ChromeModa Solutions

Germany . 2,682 parts In-Stock

1+ parts

$11.558

100+ parts

$9.478

1k+ parts

-

10k+ parts

-

2,682

$11.558

$9.478

-

-

IDEA Electronic Components Group

UK . 1,787 parts In-Stock

1+ parts

$11.558

100+ parts

$10.980

1k+ parts

$10.402

10k+ parts

-

1,787

$11.558

$10.980

$10.402

-

Microchip USA

USA . 2,504 parts In-Stock

1+ parts

$24.630

100+ parts

$24.280

1k+ parts

$24.100

10k+ parts

$23.930

2,504

$24.630

$24.280

$24.100

$23.930

A-Z Elektronik GmbH

Germany . 6,953 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,953

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-

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Authorized Procurement Solutions

USA . 1,600 parts In-Stock

1+ parts

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100+ parts

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1,600

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Futuretech Components

Singapore . 116 parts In-Stock

1+ parts

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116

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Perfect Parts

USA . 40 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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40

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-

Overview

Discover the cutting-edge TWL6032A1B4YFFT by Texas Instruments, a premium Power Management IC designed for industrial-grade applications. With 17 channels and 14 outputs, this sleek rectangular package offers top-tier performance with a maximum output current of 5A and a maximum temperature of 85°C. Texas Instruments, known for their superior quality and reliability, ensures that this IC delivers optimal power supply support while maintaining a very thin profile for space-saving solutions. Elevate your project with the TWL6032A1B4YFFT and experience unparalleled efficiency and precision in your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly without the need for through-hole mounting, saving space and reducing production costs.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration and placement on the PCB, optimizing space and layout efficiency.

No. of Terminals: 155

Provides versatility in connecting to various components and peripherals, offering flexibility in design and functionality.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating environments, making it suitable for industrial applications.

Minimum Output Voltage: 0.6 V

Provides a low minimum output voltage, suitable for powering a variety of low voltage components and devices.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low temperature conditions, making it ideal for applications in harsh environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Offers a reliable and durable terminal finish, ensuring good electrical conductivity and corrosion resistance for long-term performance.

Maximum Output Voltage: 3.3 V

Provides a maximum output voltage suitable for powering a wide range of electronic components and devices.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and soldering during PCB assembly, enhancing manufacturing efficiency.

Maximum Seated Height: 0.625 mm

Low seated height minimizes space requirements and allows for compact and slim device designs.

Width (mm): 5.214 mm

Compact width dimension enables efficient placement on the PCB, optimizing space utilization.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support applications, providing dedicated and optimized functionality for power management.

Minimum Supply Voltage (Vsup): 2.5 V

Supports a wide range of input voltages, ensuring compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient solder reflow process, minimizing production time and ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, ensuring durable and reliable solder connections during PCB assembly.

Length: 5.364 mm

Optimal length dimension for compact and space-saving designs, suitable for integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, making it suitable for industrial and rugged applications.

Maximum Output Current: 5 A

Provides high output current capacity, suitable for powering multiple components and devices simultaneously.

No. of Channels: 17

Multiple channels provide flexibility in power distribution and management, allowing for versatile connectivity and control.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and easy soldering, ensuring consistent performance and durability.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for compact design and efficient layout, optimizing space utilization on the PCB.

Maximum Supply Voltage (Vsup): 4.8 V

Supports a high supply voltage range, providing compatibility with various power sources and applications.

No. of Outputs: 14

Multiple outputs offer versatility in power distribution and management, allowing for efficient and flexible power supply designs.

Technical Specifications

Power Management ICs TWL6032A1B4YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

17

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TWL6032A1B4YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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