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TWL6030B1A4CMRR

Texas Instruments

TWL6030B1A4CMRR by Texas Instruments

TWL6030B1A4CMRR by Texas Instruments is a Power Management IC with 187 terminals, Vsup range of 2.5V to 4.8V, and operating temperature from -40°C to 85°C. It features a very thin profile grid array package suitable for industrial applications requiring power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,060 parts In-Stock

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4,060

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Vyrian

USA . 2,757 parts In-Stock

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2,757

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,561 parts In-Stock

1+ parts

$5.500

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1,561

$5.500

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Semicontronic

India . 848 parts In-Stock

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$5.500

100+ parts

$5.362

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$5.335

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848

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 1,190 parts In-Stock

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$6.500

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1,190

$6.500

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Parana Technologies

USA . 1,730 parts In-Stock

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$6.623

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$7.347

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1,730

$6.623

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$7.347

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DigiPath Technology Company

USA . 2,266 parts In-Stock

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$7.293

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$6.710

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2,266

$7.293

$6.710

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ChromeModa Solutions

Germany . 2,848 parts In-Stock

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$7.442

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$6.102

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2,848

$7.442

$6.102

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IDEA Electronic Components Group

UK . 962 parts In-Stock

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$7.442

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$6.698

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962

$7.442

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$6.698

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AZTECH Wire

Italy . 446 parts In-Stock

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$12.465

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446

$12.465

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Microchip USA

USA . 332 parts In-Stock

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$18.510

100+ parts

$18.380

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$18.380

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$18.240

332

$18.510

$18.380

$18.380

$18.240

A-Z Elektronik GmbH

Germany . 5,882 parts In-Stock

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Corphita

USA . 2,809 parts In-Stock

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Corohmni

South Africa . 244 parts In-Stock

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Overview

Unlock the power of efficient energy management with the TWL6030B1A4CMRR by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled reliability and performance. Perfect for a wide range of applications, this product ensures optimal power supply support with adjustable threshold capabilities. Experience the value of quality engineering and innovation with Texas Instruments, where cutting-edge technology meets customer satisfaction. Elevate your power management solutions with the TWL6030B1A4CMRR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB integration, saving space in the overall design.

Nominal Supply Voltage (Vsup): 3.8 V

The specific nominal supply voltage ensures compatibility with a wide range of devices requiring power management.

Maximum Operating Temperature: 85 °C

High maximum operating temperature provides reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme temperature conditions.

Terminal Form: BALL

Ball terminal form facilitates better connectivity and soldering during assembly, ensuring reliable performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures that the product is less susceptible to moisture damage during handling and storage.

Technical Specifications

Power Management ICs TWL6030B1A4CMRR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B187

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

187

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

TWL6030B1A4CMRR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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