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TWL2214CAGQER

Texas Instruments

TWL2214CAGQER by Texas Instruments

TWL2214CAGQER by Texas Instruments is a Power Management IC with 48 terminals, Vsup ranging from 3.3V to 4.3V, and adjustable threshold feature. It is designed for industrial applications with operating temperatures from -40°C to 85°C, suitable for power supply support circuits in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,279 parts In-Stock

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Digiode

USA . 162 parts In-Stock

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One Stop Electronics

USA . 897 parts In-Stock

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$3.500

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897

$3.500

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Parana Technologies

USA . 1,508 parts In-Stock

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$5.037

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$5.597

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$5.037

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DigiPath Technology Company

USA . 98 parts In-Stock

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$5.547

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$5.103

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98

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IDEA Electronic Components Group

UK . 904 parts In-Stock

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$5.660

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$5.094

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904

$5.660

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$5.094

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ChromeModa Solutions

Germany . 289 parts In-Stock

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$5.660

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$4.641

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289

$5.660

$4.641

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Semicontronic

India . 1,058 parts In-Stock

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$6.500

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$6.338

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$6.305

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$6.500

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Ampacity Inc.

Singapore . 1,047 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 400 parts In-Stock

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$19.018

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Corphita

USA . 4,849 parts In-Stock

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Corohmni

South Africa . 112 parts In-Stock

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Overview

Experience unparalleled power management with the TWL2214CAGQER by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers exceptional quality and reliability for a wide range of applications. With a package style of GRID ARRAY and a very thin profile, this product ensures efficient power supply support circuitry in industrial-grade environments. Boasting a nominal supply voltage of 3.8V and adjustable threshold features, the TWL2214CAGQER provides customers with unmatched value and benefits, making it the ideal choice for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good thermal properties and durability, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and enabling efficient assembly processes.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8V ensures stable performance and compatibility with a wide range of electronic devices.

Package Style: GRID ARRAY, VERY THIN PROFILE

The grid array package style with a very thin profile enables compact and space-saving designs, suitable for applications with limited space constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in harsh environmental conditions and high-temperature applications.

Terminal Position: BOTTOM

Bottom terminal position offers convenient soldering and mounting options, facilitating ease of use during assembly.

Minimum Supply Voltage (Vsup): 3.3 V

The minimum supply voltage of 3.3V allows for flexibility in power input requirements, making it compatible with various power sources.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures ruggedness and reliability in demanding industrial environments and extended operating conditions.

Maximum Supply Voltage (Vsup): 4.3 V

The maximum supply voltage of 4.3V offers a wide operating range for different power supply scenarios, enhancing versatility and compatibility.

Adjustable Threshold: YES

The adjustable threshold feature enables fine-tuning of power management settings, providing flexibility and customization options for specific application requirements.

Technical Specifications

Power Management ICs TWL2214CAGQER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

SYSTEM OVER AND UNDER-VOLTAGE SHUT DOWN

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B48

Length:

5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/4.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

3.3 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

TWL2214CAGQER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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