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TWL2203PFB

Texas Instruments

TWL2203PFB by Texas Instruments

TWL2203PFB by Texas Instruments is a Power Management IC with 48 terminals, operating voltage range of 2.85V to 4.25V, and temp range of -30°C to 85°C. It is used in power supply support circuits due to its thin profile, fine pitch flatpack package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,716 parts In-Stock

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5,716

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Digiode

USA . 3,534 parts In-Stock

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3,534

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Distributors (Availability)

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Semicontronic

India . 1,375 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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-

1,375

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

1+ parts

$5.500

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1,143

$5.500

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One Stop Electronics

USA . 650 parts In-Stock

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$5.500

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650

$5.500

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Parana Technologies

USA . 2,309 parts In-Stock

1+ parts

$10.634

100+ parts

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$11.126

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2,309

$10.634

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$11.126

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ChromeModa Solutions

Germany . 4,295 parts In-Stock

1+ parts

$11.948

100+ parts

$9.797

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4,295

$11.948

$9.797

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IDEA Electronic Components Group

UK . 102 parts In-Stock

1+ parts

$11.948

100+ parts

$11.351

1k+ parts

$10.753

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102

$11.948

$11.351

$10.753

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AZTECH Wire

Italy . 837 parts In-Stock

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$17.579

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837

$17.579

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Corphita

USA . 2,355 parts In-Stock

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DigiPath Technology Company

USA . 2,346 parts In-Stock

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$10.772

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2,346

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$10.772

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Corohmni

South Africa . 244 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the TWL2203PFB Power Management IC. Designed with the highest quality materials and advanced manufacturing processes, this IC offers unrivaled performance and reliability in a compact square package. Ideal for a wide range of applications, this IC provides superior power supply support and optimization. Trust Texas Instruments to deliver innovative solutions that exceed expectations, providing you with the value and benefits you need for your projects. Elevate your designs with the TWL2203PFB and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and resources during production.

Nominal Supply Voltage (Vsup): 3.75 V

Optimal supply voltage for the device, ensuring stable performance and efficiency.

No. of Terminals: 48

Sufficient number of terminals for connections and integration within various systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, offering versatility in application.

Minimum Operating Temperature: -30 °C

Can withstand low-temperature conditions, making it suitable for a wide range of operating environments.

Width (mm): 7 mm

Compact size allows for space-efficient integration within electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management, ensuring reliable and efficient performance.

Maximum Supply Voltage (Vsup): 4.25 V

Allows for a higher supply voltage input, offering flexibility in power source compatibility.

Technical Specifications

Power Management ICs TWL2203PFB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

4.25 V

Minimum Supply Voltage (Vsup):

2.85 V

Nominal Supply Voltage (Vsup):

3.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

TWL2203PFB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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