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TWL2213CAPFBR

Texas Instruments

TWL2213CAPFBR by Texas Instruments

TWL2213CAPFBR by Texas Instruments is a Power Management IC with 48 terminals in a square package. It operates b/w -40 to 85°C, supporting supply voltages from 4.5V to 6V. Ideal for industrial applications requiring adjustable threshold power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,961 parts In-Stock

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Digiode

USA . 218 parts In-Stock

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218

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Semicontronic

India . 799 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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-

799

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 589 parts In-Stock

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$3.500

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589

$3.500

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AZTECH Wire

Italy . 669 parts In-Stock

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$7.472

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669

$7.472

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Ampacity Inc.

Singapore . 202 parts In-Stock

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$7.500

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202

$7.500

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Parana Technologies

USA . 1,454 parts In-Stock

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$19.229

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$19.270

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1,454

$19.229

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$19.270

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DigiPath Technology Company

USA . 681 parts In-Stock

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$21.174

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$19.480

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681

$21.174

$19.480

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ChromeModa Solutions

Germany . 2,655 parts In-Stock

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$21.606

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$17.717

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$21.606

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IDEA Electronic Components Group

UK . 2,170 parts In-Stock

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$21.606

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$20.526

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$19.445

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$21.606

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$19.445

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Corphita

USA . 2,203 parts In-Stock

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Corohmni

South Africa . 464 parts In-Stock

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Overview

Elevate your power management capabilities with the TWL2213CAPFBR by Texas Instruments. Crafted with precision and expertise, this power management IC offers unparalleled quality and reliability. Ideal for a variety of applications, this product provides efficient power supply support circuitry in a compact, easy-to-install package. With advanced features like an adjustable threshold and a wide operating temperature range, customers can trust in the TWL2213CAPFBR to deliver superior performance and value. Say goodbye to power management challenges and hello to seamless operation with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various operating environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and enabling high-density designs.

Package Shape: SQUARE

The square shape of the package provides uniformity in design and facilitates easy placement on the PCB layout.

No. of Terminals: 48

Having 48 terminals allows for a greater number of connection options, enhancing flexibility in circuit design.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

This package style offers a compact and slim design with fine pitch leads, making it ideal for space-constrained applications and ensuring efficient power management.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperature conditions, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures from -40 to 85°C makes this product suitable for use in both extreme cold and hot conditions.

Terminal Position: QUAD

The quad terminal position provides stability and secure connections, ensuring proper functionality of the power management IC.

Maximum Seated Height: 1.2 mm

A low maximum seated height of 1.2 mm allows for compact and low-profile designs, saving space in the overall system.

Width (mm): 7 mm

The compact width of 7 mm enables easy integration into tight spaces and facilitates efficient layout of the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC provides essential functions for stable and efficient power supply management, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 4.5 V

With a low minimum supply voltage requirement of 4.5V, this IC is suitable for a wide range of power supply configurations, ensuring compatibility with various systems.

Length: 7 mm

The compact length of 7 mm contributes to the overall small footprint of the product, enabling space-efficient design and layout.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operation, this product is built to withstand harsh environmental conditions and high reliability requirements in industrial applications.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and secure soldering connections, ensuring long-term durability and reliability.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5 mm, this IC allows for high-density mounting on PCBs, enabling compact and space-saving designs.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V provides flexibility in power input options, accommodating a wide range of power supply voltages for various applications.

Adjustable Threshold: YES

The ability to adjust the threshold values allows for fine-tuning of power management settings, optimizing performance and efficiency based on specific application requirements.

Technical Specifications

Power Management ICs TWL2213CAPFBR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

TWL2213CAPFBR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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