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TWL2203GGV

Texas Instruments

TWL2203GGV by Texas Instruments

TWL2203GGV by Texas Instruments is a 64-terminal power management IC with nominal voltage of 3.75 V, suitable for power supply support circuits. It features a low profile grid array package with 0.8 mm terminal pitch and operates b/w -30 to 85 °C, making it ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,189 parts In-Stock

1+ parts

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3,189

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Digiode

USA . 1,864 parts In-Stock

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1,864

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 899 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

899

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 626 parts In-Stock

1+ parts

$4.500

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626

$4.500

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Ampacity Inc.

Singapore . 149 parts In-Stock

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$4.500

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149

$4.500

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Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

$18.522

100+ parts

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1k+ parts

$18.634

10k+ parts

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1,934

$18.522

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$18.634

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AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$18.716

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856

$18.716

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DigiPath Technology Company

USA . 416 parts In-Stock

1+ parts

$20.395

100+ parts

$18.763

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416

$20.395

$18.763

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ChromeModa Solutions

Germany . 3,818 parts In-Stock

1+ parts

$20.811

100+ parts

$17.065

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3,818

$20.811

$17.065

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IDEA Electronic Components Group

UK . 1,138 parts In-Stock

1+ parts

$20.811

100+ parts

$19.770

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$18.730

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1,138

$20.811

$19.770

$18.730

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Corphita

USA . 4,304 parts In-Stock

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4,304

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Corohmni

South Africa . 361 parts In-Stock

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361

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Overview

Experience unparalleled power management capabilities with the TWL2203GGV by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unrivaled performance and reliability. Ideal for a wide range of applications, this product provides efficient power supply support circuits in a compact package. Say goodbye to power-related issues and hello to seamless operations with the TWL2203GGV. Discover the difference quality makes with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good insulation and heat dissipation qualities for the product.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, saving time and cost.

Nominal Supply Voltage (Vsup): 3.75 V

The specified nominal supply voltage ensures optimal performance and compatibility with a wide range of power sources.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and support for various power management functions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions and maintain reliability.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures the product can function effectively in cold environments without issues.

Maximum Seated Height: 1.4 mm

The low profile design with a maximum seated height of 1.4 mm enables space-efficient installations in compact devices.

Width (mm): 8 mm

The compact width of 8 mm allows for easy integration into various electronic systems without occupying too much space.

Minimum Supply Voltage (Vsup): 2.85 V

The specified minimum supply voltage ensures the product can still function reliably even with lower power input.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation for improved performance.

Maximum Supply Voltage (Vsup): 4.25 V

The maximum supply voltage of 4.25 V allows for compatibility with higher power sources for enhanced flexibility.

Technical Specifications

Power Management ICs TWL2203GGV attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

4.25 V

Minimum Supply Voltage (Vsup):

2.85 V

Nominal Supply Voltage (Vsup):

3.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width (mm):

8 mm

Trade Compliance

TWL2203GGV Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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