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TWL2203GGVR

Texas Instruments

TWL2203GGVR by Texas Instruments

TWL2203GGVR by Texas Instruments is a 64-terminal power management IC with nominal voltage of 3.75V, suitable for power supply support circuits. It features a low profile grid array package style, operates b/w -30 to 85°C, and supports surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,423 parts In-Stock

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6,423

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Digiode

USA . 2,422 parts In-Stock

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2,422

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Distributors (Availability)

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Semicontronic

India . 439 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

439

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 698 parts In-Stock

1+ parts

$4.500

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698

$4.500

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Ampacity Inc.

Singapore . 1,261 parts In-Stock

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$5.500

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1,261

$5.500

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AZTECH Wire

Italy . 273 parts In-Stock

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$16.964

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273

$16.964

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Parana Technologies

USA . 1,672 parts In-Stock

1+ parts

$17.054

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$17.276

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1,672

$17.054

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$17.276

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DigiPath Technology Company

USA . 2,184 parts In-Stock

1+ parts

$18.779

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2,184

$18.779

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ChromeModa Solutions

Germany . 3,326 parts In-Stock

1+ parts

$19.162

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$15.713

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3,326

$19.162

$15.713

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IDEA Electronic Components Group

UK . 2,247 parts In-Stock

1+ parts

$19.162

100+ parts

$18.204

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$17.246

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2,247

$19.162

$18.204

$17.246

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Corphita

USA . 552 parts In-Stock

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552

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Corohmni

South Africa . 261 parts In-Stock

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Overview

Elevate your power management capabilities with the TWL2203GGVR by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unmatched quality and reliability for a wide range of applications. With a focus on efficiency and performance, Texas Instruments has designed this product to provide optimal power supply support while ensuring ease of installation and operation. Experience seamless integration and exceptional value with the TWL2203GGVR, setting new standards in the industry. Unlock the potential of your electronic devices with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the package, ensuring the safety of the components inside.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3.75 V

The nominal supply voltage of 3.75 V ensures compatibility with a wide range of systems and devices, making it versatile for various applications.

No. of Terminals: 64

With 64 terminals, this Power Management IC provides ample connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability even in demanding and high-temperature environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30°C allows for operation in harsh cold climates or industrial settings without performance degradation.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure PCB mounting, ensuring proper alignment and connection for optimal performance.

Width (mm): 8 mm

The compact width of 8 mm saves space on the PCB, allowing for efficient use of board real estate and enabling compact device designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC plays a crucial role in ensuring stable and efficient power delivery to the connected components for smooth operation.

Maximum Supply Voltage (Vsup): 4.25 V

The high maximum supply voltage of 4.25 V provides overhead protection against voltage spikes or fluctuations, safeguarding the connected devices from damage.

Technical Specifications

Power Management ICs TWL2203GGVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

4.25 V

Minimum Supply Voltage (Vsup):

2.85 V

Nominal Supply Voltage (Vsup):

3.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width (mm):

8 mm

Trade Compliance

TWL2203GGVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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