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TVP5150AM1PBSRG4

Texas Instruments

TVP5150AM1PBSRG4 by Texas Instruments

TVP5150AM1PBSRG4 by Texas Instruments is a color signal decoder with power supplies of 1.8V and 3.3V, suitable for PAL, NTSC, and SECAM video standards. This IC has 32 terminals in a square package style with a thin profile and fine pitch, ideal for applications requiring precise color signal conversion in commercial temperature grades. The device supports R-Y, B-Y, Y inputs and operates b/w 0°C to 70°C temperatures.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 18,190 parts In-Stock

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Digiode

USA . 2,985 parts In-Stock

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Vyrian

USA . 2,738 parts In-Stock

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2,738

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ABC Electronics Ltd.

UK . 992 parts In-Stock

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Nova Conductors

Japan . 95 parts In-Stock

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Parana Technologies

USA . 8 parts In-Stock

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$0.462

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$1.611

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8

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DigiPath Technology Company

USA . 1,902 parts In-Stock

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$0.509

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$0.468

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ChromeModa Solutions

Germany . 1,034 parts In-Stock

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$0.519

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$0.426

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$0.519

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IDEA Electronic Components Group

UK . 988 parts In-Stock

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$0.519

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$0.467

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Corohmni

South Africa . 188 parts In-Stock

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$1.600

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Ampacity Inc.

Singapore . 1,022 parts In-Stock

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$5.800

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One Stop Electronics

USA . 1,083 parts In-Stock

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$13.800

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AZTECH Wire

Italy . 695 parts In-Stock

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$16.668

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Lixinc

USA . 14,229 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,117 parts In-Stock

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Continental Prestige Electronics

USA . 4,105 parts In-Stock

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Microchip USA

USA . 2,639 parts In-Stock

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Corphita

USA . 1,114 parts In-Stock

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Argo Parts USA

USA . 913 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Experience vibrant and true-to-life colors with the TVP5150AM1PBSRG4 by Texas Instruments, a leading manufacturer known for top-quality products. As a color signal converter, this device offers seamless integration and exceptional performance in a wide range of applications. From enhancing image quality to ensuring compatibility with various video standards such as PAL, NTSC, and SECAM, this decoder is a must-have for any project that demands superior color processing. Trust Texas Instruments to deliver innovation, reliability, and value with every product, including the TVP5150AM1PBSRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or devices that may experience rough handling.

Surface Mount: YES

Surface mount technology makes the product suitable for automated assembly processes, increasing efficiency and reducing production costs.

General IC Type: COLOR SIGNAL DECODER

The color signal decoder ensures accurate and high-quality color reproduction, making this product ideal for applications where color accuracy is crucial.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with different power sources.

Video Standard: PAL; NTSC; SECAM

Compatibility with multiple video standards allows the product to be used in a wide range of applications without the need for additional converters or adapters.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard operating temperature ranges, suitable for most commercial applications.

Input Type: R-Y; B-Y; Y

Support for multiple input types enables the product to process different color signals accurately, providing versatility in signal processing.

Technical Specifications

Color Signal Converters TVP5150AM1PBSRG4 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

General IC Type:

Input Type:

R-Y; B-Y; Y

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.28SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Color Signal Converters

Maximum Supply Current:

32.9 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Video Standard:

PAL;NTSC;SECAM

Width:

5 mm

Trade Compliance

TVP5150AM1PBSRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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