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LV766106C

Onsemi

LV766106C by Onsemi

LV766106C by Onsemi is a Color Signal Converter IC with 64 terminals and 5V power supply. It operates b/w -10 °C to 65°C, suitable for commercial applications. The package style is in-line with shrink pitch, made of plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,232 parts In-Stock

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Digiode

USA . 703 parts In-Stock

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703

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Kulean Microsystems

USA . 6,688 parts In-Stock

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6,688

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TANS Electronics

Latvia . 6,658 parts In-Stock

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6,658

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Problanco Electronics

Mexico . 3,963 parts In-Stock

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SupplyDigital Components

Austria . 2,427 parts In-Stock

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UHIMA Technologies

Türkiye . 521 parts In-Stock

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521

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Corphita

USA . 512 parts In-Stock

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512

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Corohmni

South Africa . 369 parts In-Stock

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Overview

Discover the superior quality and reliability of the LV766106C by Onsemi, a top-tier manufacturer known for their cutting-edge technology. As a color signal converter, this product offers endless possibilities in applications such as video processing, image enhancement, and display systems. With a sleek rectangular design and 64 terminals, this converter provides seamless integration and optimal performance. Experience the value and benefits of this innovative solution, from its efficient power supply to its commercial-grade temperature tolerance. Elevate your projects with the LV766106C and unlock a world of vibrant color and clarity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into different electronic setups and configurations.

General IC Type: COLOR SIGNAL CONVERTER

The specific IC type ensures accurate and efficient conversion of color signals, resulting in high-quality video output.

Power Supplies (V): 5

The 5V power supply requirement is common and easy to provide, making setup and operation convenient.

No. of Terminals: 64

The high number of terminals allows for versatile connectivity options, accommodating various input and output configurations.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line and shrink pitch package style offers a space-saving design, suitable for compact electronic setups.

Maximum Operating Temperature: 65 °C

The high maximum operating temperature ensures product reliability and stability even under demanding environmental conditions.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature allows for operation in a wide range of environments, including cold temperatures.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connectivity, enhancing the product's overall reliability.

Temperature Grade: COMMERCIAL

Designed for commercial use, the product meets industry standards for performance and reliability in typical operating conditions.

Terminal Form: THROUGH-HOLE

The through-hole terminal form is durable and secure, ensuring stable connections during operation.

Maximum Supply Current: 35 mA

The maximum supply current requirement is within a reasonable range, making it suitable for various power sources and setups.

Terminal Pitch: 1.78 mm

The tight terminal pitch allows for compact PCB layout and efficient signal routing, optimizing the overall design of the product.

Technical Specifications

Color Signal Converters LV766106C attributes and parameters. Explore more Color Signal Converters devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP64,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

35 mA

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LV766106C General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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